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MPC8347EZQALF

Description
32-BIT, 667MHz, RISC PROCESSOR, PBGA620, 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,102 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8347EZQALF Overview

32-BIT, 667MHz, RISC PROCESSOR, PBGA620, 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620

MPC8347EZQALF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeBGA
package instruction29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
Contacts620
Reach Compliance Codecompliant
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B620
JESD-609 codee0
length29 mm
low power modeYES
Number of terminals620
Maximum operating temperature105 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA620,28X28,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height2.46 mm
speed667 MHz
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width29 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8347EEC
Rev. 11, 02/2009
MPC8347E PowerQUICC™ II Pro
Integrated Host Processor Hardware
Specifications
The MPC8347E PowerQUICC™ II Pro is a next generation
PowerQUICC II integrated host processor. The MPC8347E
contains a PowerPC™ processor core built on Power
Architecture™ technology with system logic for
networking, storage, and general-purpose embedded
applications. For functional characteristics of the processor,
refer to the
MPC8349E PowerQUICC™ II Pro Integrated
Host Processor Family Reference Manual.
To locate published errata or updates for this document, refer
to the MPC8347E product summary page on our website
listed on the back cover of this document or, contact your
local Freescale sales office.
NOTE
The information in this document is accurate for
revision 1.1 silicon and earlier. For information on
revision 3.0 silicon and later versions (for orderable
part numbers ending in A or B), see the
MPC8347EA PowerQUICC™ II Pro Integrated
Host Processor Hardware Specifications.
See
Section 23.1, “Part Numbers Fully Addressed
by This Document,”
for silicon revision level
determination.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Ethernet: Three-Speed Ethernet, MII Management . 22
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 55
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
System Design Information . . . . . . . . . . . . . . . . . . . 91
Document Revision History . . . . . . . . . . . . . . . . . . . 95
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 98
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© Freescale Semiconductor, Inc., 2005–2009. All rights reserved.

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