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WF128K32N-70H1M5

Description
Flash Module, 128KX32, 70ns, CPGA66, CERAMIC, PGA-66
Categorystorage    storage   
File Size749KB,16 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

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WF128K32N-70H1M5 Overview

Flash Module, 128KX32, 70ns, CPGA66, CERAMIC, PGA-66

WF128K32N-70H1M5 Parametric

Parameter NameAttribute value
MakerWhite Microelectronics
package instructionCERAMIC, PGA-66
Reach Compliance Codeunknown
Maximum access time70 ns
Other featuresCONFIGURABLE AS 128K X 32
JESD-30 codeS-CPGA-P66
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal locationPERPENDICULAR
typeNOR TYPE
WF128K32-XXX5
128K
X
32 5V FL ASH MODULE, SMD 5962-94716
FEATURES
n
Access Times of 50*, 60, 70, 90, 120, 150ns
n
n
5 Volt Programming. 5V ± 10% Supply
n
Low Power CMOS, 1mA Standby Typical
n
Embedded Erase and Program Algorithms
n
TTL Compatible Inputs and CMOS Outputs
n
Built-in Decoupling Caps and Multiple Ground Pins for
Packaging:
•66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•68 lead, Hermetic CQFP (G2U) , 22.4mm (0.880 inch)
square, 3.56mm (0.140 inch) high (Package 510)
•68 lead, Hermetic CQFP (G1U), 23.9mm (0.940 inch)
square, 3.56mm (0.140 inch) high (Package 519)
•68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch)
square, 4.06mm (0.160 inch) high (Package 524)
1
Low Noise Operation
n
n
Page Program Operation and Internal Program Control
Time
Weight
WF128K32-XG1UX5 - 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX5
1
- 8 grams typical
WF128K32-XH1X5 - 13 grams typical
n
Sector Architecture
•8 equal size sectors of 16KBytes each
•Any combination of sectors can be concurrently
erased.
Also supports full chip erase
n
100,000 Erase/Program Cycles Typical, 0°C to +70°C
n
Organized as 128Kx32
n
Commercial, Industrial and Military Temperature Ranges
FIG. 1
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
PIN DESCRIPTION
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
December 2001 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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