DP3D2MX32PY5-60C datasheet, PDF

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DP3D2MX32PY5-60C: DescriptionFast Page DRAM Module, 2MX32, 60ns, CMOS; Categorystorage storage; File Size619KB，2 Pages; ManufacturerB&B Electronics Manufacturing Company

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DP3D2MX32PY5-60C Overview

Fast Page DRAM Module, 2MX32, 60ns, CMOS

DP3D2MX32PY5-60C Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-XQMA-N66
memory density	67108864 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX32
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	QUAD

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2Mx32, 50 - 80ns, TSTACK

30A164-15

64 Megabit CMOS DRAM

DPnnD2MX32PY5

PRELIMINARY

DESCRIPTION:

The DPnnD2MX32PY5 is the 2 Meg x 32 Dynamic RAM module

that utilize the new and innovative space saving TSOP stacking

technology. The module is constructed of four 1 Meg x 16

Dynamic RAM’s that are configured as 2 banks of 1 Meg x 32.

The DPnnD2MX32PY5 provides for a compatible upgrade path

to higher density compatible modules. The module features

high speed access times, common data inputs and outputs, and

three standard refresh modes.

FEATURES:

•

Access Times: 60, 70, 80ns (max.)

•

5.0V or 3.3V Supply

•

Common Data Inputs and Outputs

•

EDO or Fast Page Mode Capability

•

4096 Cycles / 64 ms

•

3 Variations of Refresh: - RAS only Refresh

- CAS before RAS Refresh

- Hidden Refresh

•

Package: TSOP Leadless Stack

PIN-OUT DIAGRAM

PIN NAMES

A0 - A11

DQ0 - DQ31

UCAS

LCAS

RAS0 - RAS1

WE0 - WE1

OE0 - OE1

N.C.

Row Address:

A0 - A11

Column Address: A0 - A7

Refresh Address: A0 - A11

Data In / Data Out

Upper Column Addres Strobe

Lower Column Addres Stobe

Row Address Enables

Data Write Enables

Data Output Enables

Power Supply (+5V)

Ground

No Connect

FUNCTIONAL BLOCK DIAGRAM

NOTE:

Pin 43 and Pin 46 are connected together,

Pin 42 and Pin 45 are connected together.

30A164-15

REV. A

NOTE:

LCAS controls DQ0-DQ15, UCAS controlls DQ16-DQ31.

This document contains information on a product presently under

development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

DP3D2MX32PY5-60C Related Products

	DP3D2MX32PY5-60C	DP3ED2MX32PY5-60C	DPD2MX32PY5-60C	DPED2MX32PY5-60C
Description	Fast Page DRAM Module, 2MX32, 60ns, CMOS	EDO DRAM Module, 2MX32, 60ns, CMOS	Fast Page DRAM Module, 2MX32, 60ns, CMOS	EDO DRAM Module, 2MX32, 60ns, CMOS
Maker	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE WITH EDO	FAST PAGE	FAST PAGE WITH EDO
Maximum access time	60 ns	60 ns	60 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-XQMA-N66	R-XQMA-N66	R-XQMA-N66	R-XQMA-N66
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	FAST PAGE DRAM MODULE	EDO DRAM MODULE	FAST PAGE DRAM MODULE	EDO DRAM MODULE
memory width	32	32	32	32
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	66	66	66	66
word count	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	2MX32	2MX32	2MX32	2MX32
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	3.3 V	3.3 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	QUAD	QUAD	QUAD	QUAD

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