EEWORLDEEWORLDEEWORLD

Part Number

Search

TC74HCT273AFW-TP1ELP

Description
IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch
Categorylogic    logic   
File Size95KB,4 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC74HCT273AFW-TP1ELP Overview

IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch

TC74HCT273AFW-TP1ELP Parametric

Parameter NameAttribute value
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instructionSOP,
Contacts20
Reach Compliance Codeunknown
seriesHCT
JESD-30 codeR-PDSO-G20
JESD-609 codee2
length12.8 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
Number of digits8
Number of functions1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
propagation delay (tpd)38 ns
Certification statusNot Qualified
Maximum seat height2.7 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN COPPER/TIN SILVER
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE
width7.5 mm
minfmax24 MHz

TC74HCT273AFW-TP1ELP Related Products

TC74HCT273AFW-TP1ELP TC74HCT273AF-EL TC74HCT273AF-TP1EL TC74HCT273AFW-TP1 TC74HCT273AFW-ELP TC74HCT273AFW-TP2ELP TC74HCT273AFW-TP2 TC74HCT273AF-TP2EL TC74HCT273AF-TP2 TC74HCT273AF-TP1
Description IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 0.300 INCH, PLASTIC, SOIC-20, FF/Latch
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC
package instruction SOP, SOP, SOP, SOP, 0.300 INCH, PLASTIC, SOIC-20 SOP, SOP, SOP, SOP, SOP,
Contacts 20 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
series HCT HCT HCT HCT HCT HCT HCT HCT HCT HCT
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
length 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm 12.8 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Number of digits 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 20 20 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP SOP SOP SOP SOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
propagation delay (tpd) 38 ns 38 ns 38 ns 38 ns 38 ns 38 ns 38 ns 38 ns 38 ns 38 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.7 mm 1.8 mm 1.8 mm 2.7 mm 2.7 mm 2.7 mm 2.7 mm 1.8 mm 1.8 mm 1.8 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width 7.5 mm 5.3 mm 5.3 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 5.3 mm 5.3 mm 5.3 mm
minfmax 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz
Maker Toshiba Semiconductor - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
JESD-609 code e2 e0 - - - e2 - e2 e0 e0
Terminal surface TIN COPPER/TIN SILVER TIN LEAD - - - TIN COPPER/TIN SILVER - TIN COPPER/TIN SILVER Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Is it Rohs certified? - incompatible - incompatible incompatible - incompatible - incompatible incompatible
Peak Reflow Temperature (Celsius) - 240 - 240 240 - 240 - 240 240
Maximum time at peak reflow temperature - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
How to control light switches with a smartphone client
Hello everyone! I am a mobile phone software developer. I want to use iPhone or Android phone software to control the switch of the light. I only know software development and don't know much about ha...
jwkong RF/Wirelessly
Energy Harvesting Reference Design Solution for Ultra-Low Power Boost Converter IC
[align=left]A seemingly simple design actually contains the hard work and days and nights of several engineers. This design needs to be refined and repeatedly tested before it can be put on the market...
EEWORLD社区 Microcontroller MCU
Show the process of WEBENCH design + Freescale chip power design
The process of WEBENCH design + Freescale chip power supply design First enter the FPGA/UP menu of the design tool, and enter the design interface as followsSelect the required chip, as shown in the f...
gaon Analogue and Mixed Signal
(Repost) Analysis of LINUX character driver structure
I haven't read books for a long time. Recently, I reviewed the character device driver part and wrote a note.   Char Device Driver   Relevant data structures:   struct cdev {   struct kobject kobj;   ...
zhouning201 Embedded System
Sensor signal amplification problem Reverse proportional series connection
[table=98%] [tr][td][color=#444444][size=18px]The OP4277 op amp is used to amplify the output signal of the piezoresistive film. The two-stage reverse proportional operational amplifier is connected i...
EdwardsThompson Test/Measurement
FPGA-to-ASIC integration brings flexibility to microcontrollers
Microcontrollers (MCUs), which are widely used in automotive electronics, have been developing at full speed and are now facing time and cost barriers. The main benefits of using MCUs have always been...
Jacktang DSP and ARM Processors

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1363  1955  1316  1061  1992  28  40  27  22  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号