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AE413RAA681GSH

Description
General Purpose Inductor, 0.68uH, 2%, 1 Element, Ceramic-Core, SMD, 1111, CHIP
CategoryPassive components    inductor   
File Size159KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AE413RAA681GSH Overview

General Purpose Inductor, 0.68uH, 2%, 1 Element, Ceramic-Core, SMD, 1111, CHIP

AE413RAA681GSH Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCOILCRAFT
package instruction1111
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes1111
structureChip
core materialCERAMIC
DC Resistance1.47 Ω
Nominal inductance(L)0.68 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberAE413RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height2.03 mm
Package length2.92 mm
Package formSMT
Package width2.79 mm
method of packingTR, Plastic, 7 Inch
Minimum quality factor (at nominal inductance)45
Maximum rated current0.4 A
self resonant frequency345 MHz
seriesAE413RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ MEASURED AT 100MHZ
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency25 MHz
Tolerance2%
1008 CHIP INDUCTORS
Outgassing Compliant Chip Inductors
AE413RAA
High SRF and excellent Q values
Tight tolerances, many values at 1%
28 inductance values from 10 nH to 1 µH
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
40
Typical Q vs Frequency
120
100
100
90
80
100 nH
12 nH
Percent of rated
I
rms
Features high temperature materials that pass NASA low
outgassing specifications and allow operation in ambi-
ent temperatures up to 155°C. The leach-resistant base
metalization with tin-lead (Sn-Pb) terminations ensures
the best possible board adhesion.
47 nH
-40
-20
0
20
25°C
40
60
80
100
120
140 160
Ambient temperature (°C)
Q Factor
70
60
50
40
30
20
10
0
10
100
1000
10000
330 nH
750 nH
1800 nH
A
B
overall
F
G
F
E
terminal
C
I
J
I
H
D
Terminal wraparound:
approx 0.015/0,38 both ends
Frequency (MHz)
Suggested
Land Pattern
Typical L vs Frequency
A max B max
0.115 0.110
2,92
2,79
C max D ref
0.080 0.020
2,03
0,51
E
F
0.080 0.020
2,03 0,51
G
H
I
J
0.060 0.100 0.040 0.050
1,52 2,54 1,02 1,27
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing,
2.0 mm pocket depth
®
Document AE101-1 Revised 06/10/13
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
© Coilcraft, Inc. 2013
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