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MWS5101EL3

Description
Standard SRAM, 256X4, 350ns, CMOS, PDIP22,
Categorystorage    storage   
File Size843KB,6 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

MWS5101EL3 Overview

Standard SRAM, 256X4, 350ns, CMOS, PDIP22,

MWS5101EL3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time350 ns
JESD-30 codeR-PDIP-T22
JESD-609 codee0
memory density1024 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of terminals22
word count256 words
character code256
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256X4
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)6.5 V
Minimum supply voltage (Vsup)4 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

MWS5101EL3 Preview

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MWS5101EL3 Related Products

MWS5101EL3 MWS5101EL2X
Description Standard SRAM, 256X4, 350ns, CMOS, PDIP22, Standard SRAM, 256X4, 250ns, CMOS, PDIP22,
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Rochester Electronics Rochester Electronics
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 350 ns 250 ns
JESD-30 code R-PDIP-T22 R-PDIP-T22
JESD-609 code e0 e0
memory density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 4 4
Number of functions 1 1
Number of terminals 22 22
word count 256 words 256 words
character code 256 256
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 256X4 256X4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 6.5 V 6.5 V
Minimum supply voltage (Vsup) 4 V 4 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED

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