AMPAL22V10ADC datasheet, PDF - EEWORLD Datasheet

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AMPAL22V10ADC: DescriptionOT PLD, 25ns, PAL-Type, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24; CategoryProgrammable logic devices Programmable logic; File Size1MB，28 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AMPAL22V10ADC Overview

OT PLD, 25ns, PAL-Type, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24

AMPAL22V10ADC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
Architecture	PAL-TYPE
maximum clock frequency	28.5 MHz
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
Dedicated input times	11
Number of I/O lines	10
Number of entries	22
Output times	10
Number of product terms	132
Number of terminals	24
Maximum operating temperature	75 °C
Minimum operating temperature
organize	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programmable logic type	OT PLD
propagation delay	25 ns
Certification status	Not Qualified
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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AMPAL22V10ADC Related Products

	AMPAL22V10ADC	AMPAL22V10JC	AMPAL22V10PC	AMPAL22V10DC
Description	OT PLD, 25ns, PAL-Type, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24	OT PLD, 35ns, PAL-Type, TTL, PQCC28, PLASTIC, LCC-28	OT PLD, 35ns, PAL-Type, TTL, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24	OT PLD, 35ns, PAL-Type, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	QLCC	DIP	DIP
package instruction	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ	DIP, DIP24,.3	DIP, DIP24,.3
Contacts	24	28	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
maximum clock frequency	28.5 MHz	18 MHz	18 MHz	18 MHz
JESD-30 code	R-GDIP-T24	S-PQCC-J28	R-PDIP-T24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0
Dedicated input times	11	11	11	11
Number of I/O lines	10	10	10	10
Number of entries	22	22	22	22
Output times	10	10	10	10
Number of product terms	132	132	132	132
Number of terminals	24	28	24	24
Maximum operating temperature	75 °C	75 °C	75 °C	75 °C
organize	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCJ	DIP	DIP
Encapsulate equivalent code	DIP24,.3	LDCC28,.5SQ	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Programmable logic type	OT PLD	OT PLD	OT PLD	OT PLD
propagation delay	25 ns	35 ns	35 ns	35 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO
technology	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	-	1	1	1

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