BYG21M
Taiwan Semiconductor
CREAT BY ART
1.5A, 1000V Fast avalanche Surface Mount Rectifier
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
TYPICAL APPLICATION
The superior avalanche capability of BYG21M is specially
suited for free-wheeling, clamping, snubber,
demagnetization in power supplies and other power switching applications.
DO-214AC (SMA)
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound: UL flammability classification rating 94V-0
Moisture sensitivity level (MSL): level 1, per J-STD-020
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
64 mg (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage I
F
=1A
(Note 1)
I
F
=1.5A
T
J
=25°C
Maximum reverse current @ Rated V
R
T
J
=100°C
T
J
=125°C
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ) T
A
=25°C, I
(BR)R
=1.23A
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Test conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and applied reverse voltage of 4.0V
Version: A1601
E
RSM
t
rr
C
J
R
θJL
R
θJA
T
J
T
STG
I
R
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
BYG21M
1000
700
1000
1.5
50
1.5
1.6
1
10
50
30
120
13
20
70
- 55 to +150
- 55 to +150
mJ
ns
pF
°C/W
°C
°C
μA
UNIT
V
V
V
A
A
V
BYG21M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
R3
R2
BYG21M
(Note 1)
H
M2
F3
F2
F4
Note 1: Whole series with green compound
G
PACKING CODE
SUFFIX
PACKAGE
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
PACKING
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
EXAMPLE
EXAMPLE
PART NO.
BYG21MHR3G
PART NO.
BYG21M
PART NO.
SUFFIX
H
PACKING CODE
R3
PACKING CODE
SUFFIX
G
DESCRIPTION
AEC-Q101 qualified
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
FIG.1 MAXIMUM AVERAGE FORWARD
CURRENT DERATING
INSTANTANEOUS REVERSE CURRENT(μA)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
2
AVERAGE FORWARD CURRENT (A)
T
J
=125°C
10
1.5
1
1
0.5
0.1
T
J
=25°C
0
0
25
50
75
100
125
150
LEAD TEMPERATURE (
°
C)
0.01
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
70
60
JUNCTION CAPACITANCE (pF)
8.3ms single half sine wave
50
40
30
20
10
0
1
10
100
0.1
FIG. 4 TYPICAL JUNCTION CAPACITANCE
PEAK FORWARD SURGE URRENT (A)
40
f=1.0MHz
Vslg=50mVp-p
30
20
10
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
REVERSE VOLTAGE (V)
Version: A1601
BYG21M
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: A1601
Electronics Design Contest
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