W19B160BTB9M datasheet, PDF - EEWORLD Datasheet

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W19B160BTB9M: DescriptionFlash, 1MX16, 9ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48; Categorystorage storage; File Size628KB，47 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W19B160BTB9M Overview

Flash, 1MX16, 9ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48

W19B160BTB9M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	9 ns
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
width	6 mm

W19B160BTB9M Preview

W19B160BT/B DATA SHEET

-Table of Contents-

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATIONS ............................................................................................................ 6

BLOCK DIAGRAM ...................................................................................................................... 7

PIN DESCRIPTION..................................................................................................................... 8

FUNCTIONAL DESCRIPTION ................................................................................................... 9

6.1

DEVICE BUS OPERATION............................................................................................ 9

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

6.1.9

6.1.10

6.1.11

6.1.12

6.1.13

6.1.14

6.1.15

Word/Byte Configuration ..................................................................................................9

Reading Array Data ..........................................................................................................9

Writing Commands/Command Sequences.......................................................................9

Program and Erase Operation Status...............................................................................9

Standby Mode ..................................................................................................................9

Automatic Sleep Mode ...................................................................................................10

#RESET: Hardware Reset Pin........................................................................................10

Output Disable Mode......................................................................................................10

Auto-select Mode............................................................................................................10

Sector Protection and Un-protection.............................................................................11

Temporary Sector Unprotect ........................................................................................11

Hardware Data Protection ............................................................................................11

Write Pulse “Glitch” Protection .....................................................................................11

Logical Inhibit ...............................................................................................................11

Power-Up Write Inhibit..................................................................................................11

Reading Array Data ........................................................................................................12

Reset Command.............................................................................................................12

Auto-select Command Sequence ...................................................................................12

Byte/Word Program Command Sequence......................................................................13

Chip Erase Command Sequence ...................................................................................13

Sector Erase Command Sequence ................................................................................13

Unlock Bypass Command Sequence .............................................................................14

DQ7: #Data Polling.........................................................................................................14

RY/#BY: Ready/#Busy ...................................................................................................15

DQ6: Toggle Bit..............................................................................................................15

6.2

COMMAND DEFINITIONS ........................................................................................... 12

6.2.1

6.2.2

6.2.3

6.2.4

6.2.5

6.2.6

6.2.7

6.3

WRITE OPERATION STATUS..................................................................................... 14

6.3.1

6.3.2

6.3.3

-1-

Publication Release Date:Dec. /30/2008

Revision A8

W19B160BT/B DATA SHEET

6.3.4

6.3.5

6.3.6

Reading Toggle Bits DQ6/DQ2 ......................................................................................15

DQ3: Sector Erase Timer ...............................................................................................17

DQ5 : Exceeded Timing Limits .......................................................................................17

SPECIAL CHARACTERISTIC .................................................................................................. 17

TABLE OF OPERATION MODES ............................................................................................ 18

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

8.10

8.11

8.12

8.13

8.14

8.15

Device Bus Operations ................................................................................................. 18

Sector Address Table (Top Boot Block) ....................................................................... 19

Sector Address Table (Bottom Boot Block) .................................................................. 20

CFI Query Identification String...................................................................................... 21

System Interface String ................................................................................................ 21

Device Geometry Definition .......................................................................................... 22

Primary Vendor-Specific Extended Query.................................................................... 23

Command Definitions ................................................................................................... 24

Write Operation Status ................................................................................................. 25

Temporary Sector Unprotect Algorithm ........................................................................ 26

In-System Sector Protect/Unprotect Algorithms........................................................... 27

Program Algorithm........................................................................................................ 28

Erase Algorithm ............................................................................................................ 28

Data Polling Algorithm .................................................................................................. 29

Toggle Bit Algorithm ..................................................................................................... 30

Absolute Maximum Ratings .......................................................................................... 31

Operating Ranges......................................................................................................... 31

DC CHARACTERISTICS.............................................................................................. 32

AC CHARACTERISTICS.............................................................................................. 33

9.4.1

9.4.2

9.4.3

9.4.4

9.4.5

9.4.6

9.4.7

9.4.8

9.4.9

Test Condition ................................................................................................................33

AC Test Load and Waveforms .......................................................................................33

Read-Only Operations....................................................................................................34

Hardware Reset (#RESET) ............................................................................................35

Word/Byte Configuration (#BYTE)..................................................................................35

Erase and Program Operation........................................................................................36

Temporary Sector Unprotect ..........................................................................................36

Alternate #CE Controlled Erase and Program Operation ...............................................37

ELECTRICAL CHARACTERISTICS......................................................................................... 31

9.1

9.2

9.3

9.4

10.

TIMING WAVEFORMS ............................................................................................................. 38

10.1

10.2

AC Read Waveform...................................................................................................... 38

Reset Waveform ........................................................................................................... 38

-2-

W19B160BT/B DATA SHEET

10.3

10.4

10.5

10.6

10.7

10.8

10.9

10.10

10.11

11.

12.

13.

#BYTE Waveform for Read Operation ......................................................................... 39

#BYTE Waveform for Write Operation ......................................................................... 39

Programming Waveform............................................................................................... 40

Chip/Sector Erase Waveform ....................................................................................... 40

#Data Polling Waveform (During Embedded Algorithms) ............................................ 41

Toggle Bit Waveform (During Embedded Algorithms) ................................................. 41

Temporary Sector Unprotect Timing Diagram.............................................................. 42

Sector Protect and Unprotect Timing Diagram ........................................................ 42

Alternate #CE Controlled Write (Erase/Program) Operation Timing ....................... 43

LATCHUP CHARACTERISTICS .............................................................................................. 44

CAPACITANCE......................................................................................................................... 44

ORDERING INFORMATION .................................................................................................... 45

Quality Grade & Green

H: Extended (-20℃ ~85

℃

)with Green package

M:Industrial (-40℃ ~85

℃

)with Green package

SPEEDOPTION

7 : 70 ~ 79ns

9 : 90 ~ 99ns

PACKAGE TYPE

T = 48 - Pin TSOP Package, 12 x 20mm

BOOT CODE SECTOR ARCHITECTURE

T = Top sector

B = Bottom sector

DEVICE NUMBER/DESCRIPTION

W19B160B

16 Megabit (2M x-8Bit/ 1 M x 16 Bit) CMOS Flash Memory

PACKAGE DIMENSIONS ..................................................................................................................... 45

PACKAGE DIMENSIONS ..................................................................................................................... 46

14.

VERSION HISTORY ................................................................................................................. 47

-3-

Publication Release Date Dec,30, 2008

Revision A8

W19B160BT/B DATA SHEET

1. GENERAL DESCRIPTION

The W19B160B is a 16Mbit, 2.7~3.6 volt CMOS flash memory organized as 2M

8 or 1M

16 bits.

For flexible erase capability, the 16Mbits of data are divided into one 16Kbyte, two 8Kbyte, one

32Kbyte, and thirty-one 64Kbyte sectors. The word-wide (× 16) data appears on DQ15-DQ0, and

byte-wide (× 8) data appears on DQ7−DQ0. The device can be programmed and erased in-system

with a standard 2.7~3.6V power supply. A 12-volt V

is not required. The unique cell architecture of

the W19B160B results in fast program/erase operations with extremely low current consumption. The

device can also be programmed and erased by using standard EPROM programmers.

2. FEATURES

Performance

•

2.7~3.6-volt write (program and erase) operations

Fast write operation

−

Sector erase time: 0.7s (Typical)

−

Chip erases time: 25 s (Typical)

−

Byte/Word programming time: 5/7 µs (Typical)

•

Read access time: 70 ns

Typical program/erase cycles:

−

100K

Twenty-year data retention

Ultra low power consumption

−

Active current (Read): 9mA (Typical)

−

Active current (Program/erase): 20mA (Typical)

−

Standby current: 0.2

μA

(Typical)

Architecture

•

Sector erases architecture

−

One 16Kbyte, two 8Kbyte, one 32Kbyte, and thirty-one 64Kbyte sectors

−

Top or bottom boot block configurations available

−

Supports full chip erase

•

JEDEC standard byte-wide and word-wide pin-outs TTL compatible I/O

Manufactured on WinStack-S 0.13µm process technology

Available packages: 48-pin TSOP

Compatible with common Flash Memory Interface (CFI) specification

Software Features

−

Flash device parameters stored directly on the device

−

Allows software driver to identify and use a variety of different current and future Flash products

•

End of program detection

-4-

W19B160BT/B DATA SHEET

−

Software method: Toggle bit/Data polling

•

Unlock bypass program command

−

Allows the system to program bytes or words to device faster than standard program command.

Hardware Features

•

Ready/#Busy output (RY/#BY)

−

Detect program or erase cycle completion

Hardware reset pin (#RESET)

−

Reset the internal state machine to the read mode

Sector Protection

−

Sectors can be locked in-system or via programmer

−

Temporary Sector Unprotect allows changing data in protected sectors in-system

Temperature range

•

Extended temperature range (-20℃ to 85

℃)

Industrial devices ambient temperature(-40

℃

to +85

℃

)

-5-

Publication Release Date Dec,30, 2008

Revision A8

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W19B160BTB9M Related Products

	W19B160BTB9M	W19B160BBB9H	W19B160BBB9M	W19B160BBB7M	W19B160BTB7M	W19B160BBB7H
Description	Flash, 1MX16, 9ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	Flash, 1MX16, 9ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	Flash, 1MX16, 9ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	Flash, 1MX16, 7ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	Flash, 1MX16, 7ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	Flash, 1MX16, 7ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48	TFBGA, BGA48,6X8,32	6 X 8 MM, 0.80 MM PITCH, GREEN, TFBGA-48
Contacts	48	48	48	48	48	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	9 ns	9 ns	9 ns	7 ns	7 ns	7 ns
Spare memory width	8	8	8	8	8	8
startup block	TOP	BOTTOM	BOTTOM	BOTTOM	TOP	BOTTOM
command user interface	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
length	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of departments/size	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31
Number of terminals	48	48	48	48	48	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-20 °C	-40 °C	-40 °C	-40 °C	-20 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA48,6X8,32	BGA48,6X8,32	BGA48,6X8,32	BGA48,6X8,32	BGA48,6X8,32	BGA48,6X8,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Department size	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
switch bit	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm

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