Telecom IC, CMOS, PQFP100,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQFP-G100 |
| Number of terminals | 100 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.63SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 3 V |
| Certification status | Not Qualified |
| Maximum slew rate | 25 mA |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Z87L0216ASC | Z87L0316ASC | |
|---|---|---|
| Description | Telecom IC, CMOS, PQFP100, | Telecom IC, CMOS, PQFP144, |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | IXYS | IXYS |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | S-PQFP-G100 | S-PQFP-G144 |
| Number of terminals | 100 | 144 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP |
| Encapsulate equivalent code | QFP100,.63SQ,20 | QFP144,.87SQ,20 |
| Package shape | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK |
| power supply | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 25 mA | 25 mA |
| Nominal supply voltage | 3 V | 3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD |
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