0.5A, 7 CHANNEL, NPN, Si, POWER TRANSISTOR
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| package instruction | IN-LINE, R-CDIP-T16 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum collector current (IC) | 0.5 A |
| Configuration | COMPLEX |
| JESD-30 code | R-CDIP-T16 |
| JESD-609 code | e0 |
| Number of components | 7 |
| Number of terminals | 16 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | NPN |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| ULQ2003R | ULQ2004R | ULQ2002R | |
|---|---|---|---|
| Description | 0.5A, 7 CHANNEL, NPN, Si, POWER TRANSISTOR | 0.5A, 7 CHANNEL, NPN, Si, POWER TRANSISTOR | 0.5A, 7 CHANNEL, NPN, Si, POWER TRANSISTOR |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | _compli |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum collector current (IC) | 0.5 A | 0.5 A | 0.5 A |
| Configuration | COMPLEX | COMPLEX | COMPLEX |
| JESD-30 code | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Number of components | 7 | 7 | 7 |
| Number of terminals | 16 | 16 | 16 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | NPN | NPN | NPN |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON |
| Maker | STMicroelectronics | - | STMicroelectronics |
| package instruction | IN-LINE, R-CDIP-T16 | - | IN-LINE, R-CDIP-T16 |