4604M-101-RC datasheet, PDF - EEWORLD Datasheet

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4604M-101-RC: DescriptionResistor Networks Product Selection Guide; File Size2MB，62 Pages; ManufacturerBourns; Websitehttp://www.bourns.com

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4604M-101-RC Overview

Resistor Networks Product Selection Guide

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w w w . b o u r n s . c o m

Resistor Networks

II.

Product Selection Guide...........................................................278

Popular Resistance Codes........................................................284

III. Thick Film Products

Through-hole Packages

Molded DIPs...................................................................286

Molded SIPs...................................................................288

Conformal SIPs ..............................................................294

Surface Mount Packages

Wide Body ......................................................................300

Medium Body .................................................................302

Ordering Guide ...............................................................304

RC Networks

T-Filters (EMI/RFI Low-Pass Filters)...............................305

RC Terminators ..............................................................307

ECL Terminators .............................................................309

Capacitor Networks ........................................................312

IV.

Precision Thin-Film-on-Ceramic Products

Through-hole Packages ......................................................313

Surface Mount Packages ....................................................318

For a complete listing of thick film products

in stock and readily available through distri-

bution, see page 284.

VI. Designer’s Guide and Application Notes

EMI/RFI Filters................................................................320

RC Terminator Networks ................................................322

Emitter Coupled Logic Terminators ................................324

Dual Terminator Resistor Networks................................326

SCSI ...............................................................................327

R/2R Ladder Networks ...................................................330

DRAM Applications ........................................................331

Thin Film Applications ....................................................334

Soldering and Cleaning Processes .................................336

Specifications are subject to change without notice.

277

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