WE128K32NP-300H1IA datasheet, PDF

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WE128K32NP-300H1IA: DescriptionEEPROM Module, 128KX32, 300ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size497KB，14 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WE128K32NP-300H1IA Overview

EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WE128K32NP-300H1IA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	300 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
Data polling	YES
Durability	10000 Write/Erase Cycles
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	27.3 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
page size	128 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.34 mm
Maximum standby current	0.0025 A
Maximum slew rate	0.25 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
width	27.3 mm
Maximum write cycle time (tWC)	10 ms
write protect	SOFTWARE

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White Electronic Designs

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES

Access Times of 120**, 125, 140, 150, 200, 250,

300ns

Packaging:

• 66-pin, PGA Type, 27.3mm (1.075") square,

Hermetic Ceramic HIP (Package 400)

• 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm

(0.180") high, (Package 509)

Organized as 128Kx32; User Conﬁgurable as

256Kx16 or 512Kx8

Write Endurance 10,000 Cycles

Data Retention Ten Years Minimum (at +25°C)

Commercial, Industrial and Military Temperature

Ranges

Low Power CMOS

WE128K32-XXX

Automatic Page Write Operation

Page Write Cycle Time: 10ms Max

Data Polling for End of Write Detection

Hardware and Software Data Protection

TTL Compatible Inputs and Outputs

5 Volt Power Supply

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight

WE128K32-XG2TX - 8 grams typical

WE128K32-XH1X - 13 grams typical

** 120ns available for commercial and industrial temperature only.

*This product is subject to change without notice.

FIGURE 1 – PIN CONFIGURATION FOR

WE128K32N-XH1X

Top View

I/O

GND

I/O

OE#

I/O

GND

I/O

128K x 8

W E

# CS

OE#

0-16

Pin Description

I/O0-31

A0-16

WE1-4#

CS1-4#

OE#

GND

Data Input/Output

Address Inputs

Write Enable

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

Block Diagram

W E

# CS

W E

# CS

W E

# CS

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

November 2007

Rev. 11

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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