WF4M32-100G2TE5 datasheet, PDF

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WF4M32-100G2TE5: DescriptionFlash Module, 4MX32, 100ns, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETICALLY SEALED, CERAMIC, QFP-68; Categorystorage storage; File Size259KB，15 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WF4M32-100G2TE5 Overview

Flash Module, 4MX32, 100ns, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETICALLY SEALED, CERAMIC, QFP-68

WF4M32-100G2TE5 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1820321109
Parts packaging code	QFP
package instruction	22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETICALLY SEALED, CERAMIC, QFP-68
Contacts	68
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Other features	USER CONFIGURABLE AS 16M X 8
Spare memory width	16
JESD-30 code	S-CQFP-G68
JESD-609 code	e4
length	22.36 mm
memory density	134217728 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	100 °C
Minimum operating temperature	-55 °C
organize	4MX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
type	NOR TYPE
width	22.36 mm

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White Electronic Designs

4MX32 5V FLASH MODULE

FEATURES

Access Times of 100, 120, 150ns

Packaging:

• 66 pin, PGA Type, 1.385" square, Hermetic

Ceramic HIP (Package 402).

• 68 lead, 40mm Low Profile CQFP ( Package

502 ), 3.5mm (0.140") height.

• 68 lead, Hermetic CQFP (G2T), 22.4mm

(0.880") square (Package 509) 4.57mm

(0.180") height. Designed to fit JEDEC 68

lead 0.990CQFJ footprint (Fig. 3)

Sector Architecture

• 32 equal size sectors of 64KBytes per each

2Mx8 chip

• Any combination of sectors can be erased. Also

supports full chip erase.

Minimum 100,000 Write/Erase Cycles Minimum

Organized as 4Mx32

WF4M32-XXX5

PRELIMINARY*

User configurable as 8Mx16 or 16Mx8 in HIP and

G4T packages.

Commercial, Industrial, and Extended

Temperature Ranges

5 Volt Read and Write. 5V ± 10% Supply.

Low Power CMOS

Data Polling and Toggle Bit feature for detection

of program or erase cycle completion.

Supports reading or programming data to a

sector not being erased.

RESET pin resets internal state machine to the

read mode.

Built-in Decoupling Caps and Multiple Ground

Pins for Low Noise Operation, Separate Power

and Ground Planes to improve noise immunity

*This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

Note:

For programming information refer to Flash Programming 16M5

Application Note.

. 1

I/O

ONFIGURATION

WF4M32-XH2X5

IEW

RESET

ESCRIPTION

I/O

0-31

Data Inputs/Outputs

0-21

1-4

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Reset

I/O

A20

GND

I/O

GND

I/O

GND

RESET

LOCK

IAGRAM

I/O

0-20

RESET

2M x 8

2Mx 8

2M x 8

x 8

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

December 2003 Rev. 5

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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