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WS512K32V-20G1UM

Description
SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 23.90 MM, LOW PROFILE, CERAMIC, QFP-68
Categorystorage    storage   
File Size154KB,8 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WS512K32V-20G1UM Overview

SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 23.90 MM, LOW PROFILE, CERAMIC, QFP-68

WS512K32V-20G1UM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction23.90 MM, LOW PROFILE, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time20 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.2 A
Minimum standby current3 V
Maximum slew rate0.4 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
White Electronic Designs
512Kx32 SRAM 3.3V MULTICHIP PACKAGE
FEATURES
n
Access Times of 15, 17, 20ns
n
Low Voltage Operation
n
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 23.9mm (0.940 inch) sq., Low Profile CQFP,
(G1T), 4.06 (0.160 inch) high, (Package 524)
• 68 lead, 22.4mm (0.880 inch) CQFP, (G2U),
3.56mm (0.140"), (Package 510)
• 68 lead, 23.9mm (0.940 inch) sq., Low Profile
CQFP, (G1U)
1
, 3.56mm (0.140 inch) high,
(Package 519)
n
Organized as 512Kx32; User Configurable as
1Mx16 or 2Mx8
n
Commercial, Industrial and Military Temperature
Ranges
n
n
n
n
n
n
n
WS512K32V-XXX
PRELIMINARY*
Low Voltage Operation:
• 3.3V ± 10% Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Fully Static Operation:
• No clock or refresh required.
Three State Output.
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS512K32V-XG1TX - 5 grams typical
WS512K32V-XG1UX
1
- 5 grams typical
WS512K32V-XG2UX - 8 grams typical
WS512K32NV-XH1X - 13 grams typical
Note 1: Package Not Recommended For New Design
*This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
P
IN
C
ONFIGURATION
F
OR
WS512K32NV-XH1X
T
OP
V
IEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
18
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
8
8
8
8
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
56
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
March 2003 Rev. 8
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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