|
72115L25J8 |
72115L25J |
72105L25J |
72105L25J8 |
72105L50J8 |
| Description |
PLCC-32, Reel |
PLCC-32, Tube |
PLCC-32, Tube |
PLCC-32, Reel |
PLCC-32, Reel |
| Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Parts packaging code |
PLCC |
PLCC |
PLCC |
PLCC |
PLCC |
| package instruction |
QCCJ, |
LCC-32 |
LCC-32 |
QCCJ, |
QCCJ, |
| Contacts |
32 |
32 |
32 |
32 |
32 |
| Manufacturer packaging code |
PL32 |
PL32 |
PL32 |
PL32 |
PL32 |
| Reach Compliance Code |
not_compliant |
not_compliant |
_compli |
_compli |
_compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
14 ns |
14 ns |
14 ns |
14 ns |
15 ns |
| period time |
20 ns |
20 ns |
20 ns |
20 ns |
25 ns |
| JESD-30 code |
R-PQCC-J32 |
R-PQCC-J32 |
R-PQCC-J32 |
R-PQCC-J32 |
R-PQCC-J32 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
| memory density |
8192 bit |
8192 bit |
4096 bi |
4096 bi |
4096 bi |
| memory width |
16 |
16 |
16 |
16 |
16 |
| Humidity sensitivity level |
3 |
1 |
1 |
3 |
3 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
32 |
32 |
32 |
32 |
32 |
| word count |
512 words |
512 words |
256 words |
256 words |
256 words |
| character code |
512 |
512 |
256 |
256 |
256 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
512X16 |
512X16 |
256X16 |
256X16 |
256X16 |
| Exportable |
NO |
NO |
NO |
NO |
NO |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
QCCJ |
QCCJ |
QCCJ |
QCCJ |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Parallel/Serial |
PARALLEL/SERIAL |
PARALLEL/SERIAL |
PARALLEL/SERIAL |
PARALLEL/SERIAL |
PARALLEL/SERIAL |
| Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
225 |
225 |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
J BEND |
J BEND |
J BEND |
J BEND |
J BEND |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |