REVISIONS
LTR
A
DESCRIPTION
Added device types 04, 05, and 06. Updated drawing to reflect the
latest requirements of MIL-PRF-38534. -sld
DATE (YR-MO-DA)
03-12-16
APPROVED
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
A
17
A
18
REV
SHEET
PREPARED BY
Steve Duncan
CHECKED BY
Michael C. Jones
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Raymond Monnin
DRAWING APPROVAL DATE
99-10-14
REVISION LEVEL
A
MICROCIRCUIT, MEMORY, DIGITAL, FLASH
EPROM, 2M X 8-BIT, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
67268
1 OF
18
5962-97609
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E083-04
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type 1/
01
02
03
04
05
06
Generic number
WMF2M8-150DAQ5
WMF2M8-120DAQ5
WMF2M8-90DAQ5
WMF2M8-150DAQE5
WMF2M8-120DAQE5
WMF2M8-90DAQE5
Circuit function
FLASH EPROM, 2M x 8-bit
FLASH EPROM, 2M x 8-bit
FLASH EPROM, 2M x 8-bit
FLASH EPROM, 2M x 8-bit
FLASH EPROM, 2M x 8-bit
FLASH EPROM, 2M x 8-bit
Access time
150 ns
120 ns
90 ns
150 ns
120 ns
90 ns
-
97609
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
E
1/ The case operating temperature range (T
C
) is -55°C to +125°C for device types 01 through 03, and -55°C to +100°C
for device types 04 through 06.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
A
5962-97609
SHEET
2
DSCC FORM 2234
APR 97
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
56
Package style
Ceramic flatpack, lead formed
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) 2/ ............................................................
Signal voltage range (any pin except A9) 2/ .......................................
Power dissipation (P
D
) ........................................................................
Storage temperature range.................................................................
Lead temperature (soldering, 10 seconds) .........................................
Data retention .....................................................................................
Endurance (write/erase cycles)...........................................................
RESET, OE, and A9 voltage for auto select and sector protect (V
ID
):
............................................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) .................................................................
Input low voltage range (V
IL
) ...............................................................
Input high voltage range (V
IH
) .............................................................
Case operating temperature range (T
C
):
Device types 01 through 03 ..............................................................
Device types 04 through 06 ..............................................................
RESET, OE, and A9 voltage for auto select and sector protect (V
ID
):
............................................................................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.5 V dc
-55°C to +125°C
-55°C to +100°C
+11.5 V dc to +12.5 V dc
-2.0 V dc to +7.0 V dc
-2.0 V dc to +7.0 V dc
0.33 W maximum at 5 MHz
-65°C to +150°C
+300°C
10 years minimum
10,000 cycles minimum
-2.0 V dc to +12.5 V dc 3/
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum DC voltage in input or I/O pins is -0.5 V dc. During voltage transitions, inputs may overshoot V
SS
to -2.0 V dc for
periods up to 20 ns. Maximum DC voltage on output and I/O pins V
CC
+0.5 V dc. During voltage transitions, outputs may
overshoot to V
CC
+2.0 V dc for periods up to 20 ns.
3/ Minimum DC input voltage on RESET, OE, and A9 is -0.5 V dc. During voltage transitions, RESET, OE, and A9 may
overshoot V
SS
to -2.0 V dc for periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot
to +14.0 V dc for periods up to 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
A
5962-97609
SHEET
3
DSCC FORM 2234
APR 97
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagrams. The timing diagram(s) shall be specified on figures 4, 5, and 6.
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
A
5962-97609
SHEET
4
DSCC FORM 2234
APR 97
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor’s reliability monitors. This
reprogrammability test shall be done for the intial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range as specified herein. The vendors
procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor’s reliabilty monitors. This test
shall be done for the intial characterization and after any design or process change which may affect data retention. The
methods and procedures may be vendor specific, but shall gurantee the number of years listed in section 1.3 herein over the
full military temperature range as specified herein. The vendor’s procedure shall be kept under document control and shall be
made available upon request of the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
A
5962-97609
SHEET
5
DSCC FORM 2234
APR 97
PCB Design
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