DP8522AV-20 datasheet, PDF - EEWORLD Datasheet

DP8522AV-20: Description4M X 1, DRAM CONTROLLER, PQCC84; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，89 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DP8522AV-20 Overview

4M X 1, DRAM CONTROLLER, PQCC84

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCJ, LDCC84,1.2SQ
Reach Compliance Code	unknown
Address bus width	24
boundary scan	NO
maximum clock frequency	20 MHz
External data bus width
JESD-30 code	S-PQCC-J84
JESD-609 code	e0
length	29.21 mm
low power mode	YES
memory organization	4M X 1
Number of blocks	4
Number of terminals	84
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	75 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	29.21 mm
uPs/uCs/peripheral integrated circuit type	MEMORY CONTROLLER, DRAM

	DP8522AV-20	DP8521A	DP8522A	DP8520A
Description	4M X 1, DRAM CONTROLLER, PQCC84	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN	IC,MEMORY CONTROLLER,CMOS,LDCC,68PIN
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	QCCJ, LDCC84,1.2SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J84	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0
Number of terminals	84	68	68	68
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	75 mA	95 mA	95 mA	95 mA
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Base Number Matches	-	1	1	1

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