93LC66AT-I/SM datasheet, PDF - EEWORLD Datasheet

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93LC66AT-I/SM: Description512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8; Categorystorage storage; File Size57KB，3 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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93LC66AT-I/SM Overview

512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8

93LC66AT-I/SM Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	SOIC
package instruction	SOP, SOP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	10
Durability	10000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	5.28 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	2.03 mm
Serial bus type	MICROWIRE
Maximum standby current	0.00003 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5.2 mm
Maximum write cycle time (tWC)	6 ms
write protect	SOFTWARE

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Author:

AN671

The following product conversion decision tree will

assist in converting from the old to the new devices. In

order to properly convert to new products two items

need to be known about the application; the operating

voltage of the system and whether the memory is orga-

nized as x8 or x16.

Converting from 93LC56/56B/66/66B Devices to 93LC56A/56B/66A/66B Devices

Shannon Poulin

Microchip Technology Inc.

DESCRIPTION

This application note details the process of converting

from 93LC56, 93LC56B, 93LC66, and 93LC66B type

devices to Microchip’s new 93LC56A, 93LC56B,

93LC66A, and 93LC66B devices. The new devices

offer improved data polling, lower standby current,

lower operating current and are available in a small

8-pin TSSOP package. The new devices also offer ﬁxed

device organization. For example, the “A” sufﬁx on the

93LC56A indicates that the device is organized as x8

only. The “B” sufﬁx indicates that the 93LC56B is orga-

nized as x16 only.

The new devices also incorporate power protection cir-

cuitry that adds extra data protection when powering

the device up and down. The 93LCxxA/B devices are

designed to function as 2.5V-6.0V parts. The internal

voltage-detect circuit inhibits writes at < 2.2V nominally.

The operational parameters of the old and new devices

are outlined below.

Part Number Organization

93LC56

x8 or x16

93LC56B

x16 only

93LC66

x8 or x16

93LC66B

x16 only

93AA56

x8 or x16

93AA66

x8 or x16

93LC56A

NEW

x8 only

93LC56B

NEW

x16 only

93LC66A

NEW

x8 only

93LC66B

NEW

x16 only

Operating Range

2.0V-6.0V

1.8V-6.0V

2.5V-6.0V

PRODUCT CONVERSION

DECISION TREE

CURRENTLY USING

93LC56/93LC56B

93LC66/93LC66B

2.5V

6.0V?

YES

ORG?

X16

USE 93LC56B

OR 93LC66B

USE 93LC56A

OR 93LC66A

USE 93AA56

OR 93AA66

1997 Microchip Technology Inc.

DS00671A-page 1

93LC66AT-I/SM Related Products

	93LC66AT-I/SM	93LC66A-I/SM	93LC56BT-I/SM	93LC56BT/P	93LC56BT/SM
Description	512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8	512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	Microchip	Microchip	Microchip	Microchip	Microchip
Parts packaging code	SOIC	SOIC	SOIC	DIP	SOIC
package instruction	SOP, SOP8,.3	SOP, SOP8,.3	SOP, SOP8,.3	DIP,	SOP, SOP8,.3
Contacts	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8
JESD-609 code	e3	e3	e3	e3	e3
length	5.28 mm	5.28 mm	5.28 mm	9.46 mm	5.28 mm
memory density	4096 bit	4096 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	16	16	16
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
word count	512 words	512 words	128 words	128 words	128 words
character code	512	512	128	128	128
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-
organize	512X8	512X8	128X16	128X16	128X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	2.03 mm	2.03 mm	4.32 mm	2.03 mm
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	MATTE TIN	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	40	NOT SPECIFIED	40
width	5.2 mm	5.2 mm	5.2 mm	7.62 mm	5.2 mm
Maximum write cycle time (tWC)	6 ms	6 ms	6 ms	6 ms	6 ms
Other features	1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS	1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS	1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS	-	1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Data retention time - minimum	10	200	200	-	200
Durability	10000 Write/Erase Cycles	1000000 Write/Erase Cycles	10000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles
Encapsulate equivalent code	SOP8,.3	SOP8,.3	SOP8,.3	-	SOP8,.3
power supply	3/5 V	3/5 V	3/5 V	-	3/5 V
Maximum standby current	0.00003 A	0.000001 A	0.00003 A	-	0.000001 A
Maximum slew rate	0.003 mA	0.0015 mA	0.003 mA	-	0.0015 mA
Nominal supply voltage (Vsup)	3 V	3 V	3 V	-	3 V
write protect	SOFTWARE	SOFTWARE	SOFTWARE	-	SOFTWARE

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