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MLG1608B18NJT

Description
1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
CategoryPassive components    inductor   
File Size49KB,4 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Environmental Compliance
Download Datasheet Parametric View All

MLG1608B18NJT Overview

1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

MLG1608B18NJT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTDK Corporation
package instructionCHIP, 0603, HALOGEN FREE AND ROHS COMPLIANT
Reach Compliance Codecompli
ECCN codeEAR99
uppercase and lowercase codes0603
structureMonolithic
core materialCERAMIC
DC Resistance0.32 Ω
Nominal inductance(L)0.018 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee1
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.8 mm
Package length1.6 mm
Package formSMT
Package width0.8 mm
method of packingTR
Minimum quality factor (at nominal inductance)12
Maximum rated current0.6 A
self resonant frequency2600 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ FACTOR IS MEASURED AT 100MHZ
surface mountYES
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance3%
(1/4)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG1608
FEATURES
• Nominal inductance values are supported from 1 to 680nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
1.6±0.15
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 1608 B 2N2 S T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1608
1.6× 0.8mm (L× W)
(3) Material code
(4) Inductance value
2N2
12N
R10
2.2nH
12nH
100nH
(5) Inductance tolerance
0.8±0.15
S
D
J
0.3±0.2
±0.3nH
±0.5nH
±5%
(6) Packaging style
T
Taping (reel)
0.8±0.15
SPECIFICATIONS
Weight: 4mg
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
RECOMMENDED PC BOARD PATTERN
PACKAGING STYLE AND QUANTITIES
2.0
0.8
Packaging style
Taping
Quantity
4000 pieces/reel
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
006-01 / 20080406 / e521_mlg1608.fm
0.8

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