SRAM Module, 128KX36, 12ns, CMOS
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | DIMM, DIMM144,32 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 12 ns |
| I/O type | COMMON |
| JESD-30 code | R-XZMA-N144 |
| JESD-609 code | e0 |
| memory density | 4718592 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 36 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 144 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX36 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM144,32 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Minimum standby current | 3.15 V |
| Maximum slew rate | 0.39 mA |
| Maximum supply voltage (Vsup) | 3.465 V |
| Minimum supply voltage (Vsup) | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.8 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | 30 |
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