M24C16, M24C08
M24C04, M24C02, M24C01
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C Bus EEPROM
FEATURES SUMMARY
■
■
■
■
■
■
■
■
■
■
Two Wire I
2
C Serial Interface
Supports 400kHz Protocol
Single Supply Voltage:
– 4.5 to 5.5V for M24Cxx
– 2.5 to 5.5V for M24Cxx-W
– 1.8 to 5.5V for M24Cxx-R
Write Control Input
BYTE and PAGE WRITE (up to 16 Bytes)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Programming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Behavior
More than 1 Million Erase/Write Cycles
More than 40 Year Data Retention
Figure 1. Packages
8
1
PDIP8 (BN)
8
1
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
TSSOP8 (DS)
3x3mm² body size (MSOP)
UFDFPN8 (MB)
2x3mm² (MLP)
March 2004
1/29
M24C16, M24C08, M24C04, M24C02, M24C01
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power On Reset: VCC Lock-Out Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. DIP, SO, TSSOP and MLP Connections (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4. Maximum RL Value versus Bus Capacitance (CBUS) for an I2C Bus . . . . . . . . . .
Figure 5. I2C Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.....5
.....5
.....5
.....5
.....5
.....6
.....6
DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Write Mode Sequences with WC=1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. Write Mode Sequences with WC=0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 8. Write Cycle Polling Flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Minimizing System Delays by Polling On ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 9. Read Mode Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Sequential Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/29
M24C16, M24C08, M24C04, M24C02, M24C01
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Operating Conditions (M24Cxx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 6. Operating Conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 7. Operating Conditions (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 9. Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. DC Characteristics (M24Cxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. DC Characteristics (M24Cxx, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 12. DC Characteristics (M24Cxx-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 13. DC Characteristics (M24Cxx-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 14. DC Characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 15. AC Characteristics (M24Cxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 16. AC Characteristics (M24Cxx, Device Grade 3; M24Cxx-W, Device Grade 6 or 3) . . . . . 18
Table 17. AC Characteristics (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 11.AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 21
Table 18. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 21
Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 22
Table 19. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
22
Figure 14.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
23
Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data .
23
Figure 15.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 24
Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 24
Figure 16.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline
25
Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data
25
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 23. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 24. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 27
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 25. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3/29
M24C16, M24C08, M24C04, M24C02, M24C01
SUMMARY DESCRIPTION
These I
2
C-compatible electrically erasable pro-
grammable memory (EEPROM) devices are orga-
nized as 2048/1024/512/256/128 x 8 (M24C16,
M24C08, M24C04, M24C02, M24C01).
Figure 2. Logic Diagram
When writing data to the memory, the device in-
serts an acknowledge bit during the 9
th
bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a Stop condition after an Ack for Write, and after a
NoAck for Read.
Table 1. Signal Names
E0, E1, E2
Chip Enable
Serial Data
Serial Clock
Write Control
Supply Voltage
Ground
VCC
3
E0-E2
SCL
WC
M24Cxx
SDA
SDA
SCL
WC
V
CC
V
SS
VSS
AI02033
I
2
C uses a two wire serial interface, comprising a
bi-directional data line and a clock line. The devic-
es carry a built-in 4-bit Device Type Identifier code
(1010) in accordance with the I
2
C bus definition.
The device behaves as a slave in the I
2
C protocol,
with all memory operations synchronized by the
serial clock. Read and Write operations are initiat-
ed by a Start condition, generated by the bus mas-
ter. The Start condition is followed by a Device
Select Code and RW bit (as described in
Table 2.),
terminated by an acknowledge bit.
Power On Reset: V
CC
Lock-Out Write Protect
In order to prevent data corruption and inadvertent
Write operations during Power-up, a Power On
Reset (POR) circuit is included. At Power-up, the
internal reset is held active until V
CC
has reached
the POR threshold value, and all operations are
disabled – the device will not respond to any com-
mand. In the same way, when V
CC
drops from the
operating voltage, below the POR threshold value,
all operations are disabled and the device will not
respond to any command.
A stable and valid V
CC
(as defined in
Table 6.
and
Table 7.)
must be applied before applying any log-
ic signal.
Figure 3. DIP, SO, TSSOP and MLP Connections (Top View)
M24Cxx
16Kb /8Kb /4Kb /2Kb /1Kb
NC / NC / NC / E0 / E0
NC / NC / E1 / E1 / E1
NC / E2 / E2 / E2 / E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI02034E
Note: 1. NC = Not Connected
2. See
PACKAGE MECHANICAL
section for package dimensions, and how to identify pin-1.
4/29
M24C16, M24C08, M24C04, M24C02, M24C01
SIGNAL DESCRIPTION
Serial Clock (SCL).
This input signal is used to
strobe all data in and out of the device. In applica-
tions where this signal is used by slave devices to
synchronize the bus to a slower clock, the bus
master must have an open drain output, and a
pull-up resistor can be connected from Serial
Clock (SCL) to V
CC
. (Figure
4.
indicates how the
value of the pull-up resistor can be calculated). In
most applications, though, this method of synchro-
nization is not employed, and so the pull-up resis-
tor is not necessary, provided that the bus master
has a push-pull (rather than open drain) output.
Serial Data (SDA).
This bi-directional signal is
used to transfer data in or out of the device. It is an
open drain output that may be wire-OR’ed with
other open drain or open collector signals on the
bus. A pull up resistor must be connected from Se-
rial Data (SDA) to V
CC
. (Figure
4.
indicates how
the value of the pull-up resistor can be calculated).
Chip Enable (E0, E1, E2).
These input signals
are used to set the value that is to be looked for on
the three least significant bits (b3, b2, b1) of the 7-
bit Device Select Code. These inputs must be tied
to V
CC
or V
SS
, to establish the Device Select
Code.
Write Control (WC).
This input signal is useful
for protecting the entire contents of the memory
from inadvertent write operations. Write opera-
tions are disabled to the entire memory array when
Write Control (WC) is driven High. When uncon-
nected, the signal is internally read as V
IL
, and
Write operations are allowed.
When Write Control (WC) is driven High, Device
Select and Address bytes are acknowledged,
Data bytes are not acknowledged.
Figure 4. Maximum R
L
Value versus Bus Capacitance (C
BUS
) for an I
2
C Bus
VCC
20
Maximum RP value (kΩ)
16
RL
12
8
4
0
10
100
CBUS (pF)
AI01665
RL
SDA
MASTER
fc = 100kHz
fc = 400kHz
SCL
CBUS
CBUS
1000
5/29
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