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89HPES4T4G2ZBALG8

Description
FCBGA-324, Reel
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size862KB,31 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89HPES4T4G2ZBALG8 Overview

FCBGA-324, Reel

89HPES4T4G2ZBALG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionBGA, BGA324,18X18,40
Contacts324
Manufacturer packaging codeALG324
Reach Compliance Codecompliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI; SMBUS
maximum clock frequency100 MHz
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum slew rate752 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
4-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES4T4G2
Data Sheet
The 89HPES4T4G2, a 4-lane 4-port Gen2 PCI Express® switch, is a
member of IDT’s PRECISE™ family of PCI Express switching solutions.
The PES4T4G2 is a peripheral chip that performs PCI Express base
switching with a feature set optimized for servers, storage, communica-
tions, and consumer applications. It provides connectivity and switching
functions between a PCI Express upstream port and three downstream
ports or peer-to-peer switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Four Gen2 PCI Express lanes supporting 5 Gbps and
2.5 Gbps operations
– Four switch ports
• One x1 upstream port
• Three x1 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2Kbytes
– Supports one virtual channel and eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
4-Port Switch Core / 4 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
May 23, 2013
DSC 6928

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Description FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Contains lead Lead free Contains lead
Is it Rohs certified? conform to conform to conform to conform to incompatible incompatible conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
package instruction BGA, BGA324,18X18,40 FCBGA-324 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA, BGA324,18X18,40
Contacts 324 324 324 324 324 324 324 324
Manufacturer packaging code ALG324 ALG324 ALG324 ALG324 AL324 AL324 ALG324 AL324
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI; SMBUS PCI PCI SMBUS PCI PCI SMBUS PCI
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e1 e1 e1 e0 e0 e1 e0
length 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4 4 4 4 4
Number of terminals 324 324 324 324 324 324 324 324
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 260 225 225 260 225
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED 30
width 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
maximum clock frequency 100 MHz 100 MHz 100 MHz - 100 MHz 100 MHz - 100 MHz
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 - BGA324,18X18,40
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified

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