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SFF3810Q

Description
Power Field-Effect Transistor, 60A I(D), 75V, 0.003ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, MODIFIED TO-258, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size146KB,2 Pages
ManufacturerSSDI
Websitehttp://www.ssdi-power.com/
Download Datasheet Parametric View All

SFF3810Q Overview

Power Field-Effect Transistor, 60A I(D), 75V, 0.003ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, MODIFIED TO-258, 3 PIN

SFF3810Q Parametric

Parameter NameAttribute value
MakerSSDI
Parts packaging codeTO-258
package instructionFLANGE MOUNT, R-XSFM-P3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Avalanche Energy Efficiency Rating (Eas)3000 mJ
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage75 V
Maximum drain current (ID)60 A
Maximum drain-source on-resistance0.003 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-XSFM-P3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountNO
Terminal formPIN/PEG
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
Solid State Devices, Inc.
14701 Firestone Blvd * La Mirada, Ca 90638
Phone: (562) 404-4474 * Fax: (562) 404-1773
ssdi@ssdi-power.com * www.ssdi-power.com
SFF3810 Series
350 AMP , 75 Volts, 2.5 mΩ
Avalanche Rated N-channel
TrenchFET
Features:
Rugged poly-Si gate
Lowest ON-resistance in the industry
Avalanche rated
Hermetically Sealed, Isolated Package
Low Total Gate Charge
Fast Switching
TX, TXV, S-Level screening available
Improved (R
DS(ON)
Q
G
) figure of merit
DESIGNER’S DATA SHEET
Part Number / Ordering Information
1/
SFF3810 ___ ___ ___
Screening
2/
__ = Not Screened
TX = TX Level
TXV = TXV Level
S = S Level
Lead Option
3/
Package
3/ 4/
__ = Straight Leads
DB = Down Bend
UB = Up Bend
Q = TO-258 modified
E = MILPACK III
Maximum Ratings
5/
Drain - Source Voltage
Gate – Source Voltage
Max. Continuous Drain Current (package
limited)
Max. Instantaneous Drain Current (Tj limited)
Max. Avalanche current
Single and Repetitive Avalanche Energy
Total Power Dissipation
Operating & Storage Temperature
Maximum Thermal Resistance
(Junction to Case)
NOTES:
*Pulse Test: Pulse Width = 300µsec, Duty Cycle = 2%.
1/ For ordering information, price, and availability - contact
factory.
2/ Screening based on MIL-PRF-19500. Screening flows
available on request.
3/ For lead bending options / pinout configurations - contact
factory.
4/ Maximum current limited by package configuration
5/ Unless otherwise specified, all electrical characteristics
o
@25 C.
Symbol
V
DSS
continuous
transient
Value
75
+ 20
+ 30
60
350
150
200
3000
600
-55 to 175
0.5
Units
V
V
A
A
A
mJ
W
ºC
ºC/W
V
GS
I
D1
I
D2
I
D3
I
AR
E
AS
P
D
T
OP
& T
STG
R
θJC
@ T
C
= 25ºC
@ T
C
= 25ºC
@ T
C
= 125ºC
@ L= 0.1 mH
@ L= 0.1 mH
@ T
C
= 25ºC
MILPACK III (E)
TO-258 modified (Q)
NOTE:
All specifications are subject to change without notification.
SCD's for these devices should be reviewed by SSDI prior to release.
DATA SHEET #: FT0051A
DOC

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