iC-LO
TRIANGULATION SENSOR
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APPLICATIONS
o
Diffuse reflective photoelectric
sensors
FEATURES
o
Specially formed line image sensor comprising 129 elements
o
High ambient light suppression of up to 100 kLux with filter
glass
o
Dynamic range of 100 dB
o
2 antivalent switching outputs
o
Alarm message output
o
High switching frequencies
o
Low latency
o
Power-down reset output
o
Write protection for internal registers
PACKAGES
oBGA LO1C
™
BLOCK DIAGRAM
VDD
Near Channel
VREF
VCC
-
VREF
-
ON
Adder
VREF
VS
VTHSw
-
+
KSw
+
+
VTHSe
-
+
KSe
WARN
Far Channel
-
VREF
AC Transimpedance Amplifier
-
OF
VREF
VREF
+
VD
VTHD
-
+
KD
SO
NSO
+
Programmable Differential Amplifier
Programmable
Comparators
IF
IN
iC-LO
Oscillator
2 MHz
Signal Processing
and FSM
NRES
VDD
Power-Down
Reset
Low-Side-
LED Driver
SPI Interface
Configurable Photodiode Array
Bandgap
Reference
VCCL
LED
MOSI MISO SCK NCS GND
GNDA
GNDL
Copyright © 2012 iC-Haus
http://www.ichaus.com
iC-LO
TRIANGULATION SENSOR
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DESCRIPTION
iC-LO is suitable for the assembly of diffuse reflec-
tive photoelectric sensors based on the principle of
triangulation. Besides iC-LO, all that is required to
create such a setup is a transmitting LED, a low-cost
microcontroller, and a driver device for the switching
output.
The iC contains a photodiode array, consisting of one
near diode, 127 middle diodes, and one far diode.
The diode photocurrents are segmented on two AC
amplifiers (near and far channel). The AC amplifiers
ensures a very good suppression of low-frequency
interference. The sum and difference are calculated
from the output voltages of the amplifiers; these are
evaluated by comparators. From the comparator sig-
nals a programmable filter for the evaluation of mul-
tiple measurements generates the switching signal
for the light sensor and also a warning on weak re-
ceived light. The gain characteristic is dynamically
adjusted to the intensity of the received light and be-
comes a logarithmic characteristic with very power-
ful input signals (reflective objects). This results in
a very high dynamic range. The integrated low side
driver can drive an LED directly or control an external
driver by CMOS output.
iC-LO is configured using an SPI interface. The in-
ternal registers can be protected against overwriting.
iC-LO
TRIANGULATION SENSOR
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CONTENTS
PACKAGES
ABSOLUTE MAXIMUM RATINGS
THERMAL DATA
ELECTRICAL CHARACTERISTICS
CONFIGURATION PARAMETERS
REGISTER MAP
MEASURING SEQUENCE
LED DRIVER
NEAR/FAR CHANNEL PARTITION AND
AMPLIFICATION
Current/Voltage conversion . . . . . . . . . .
Channel partitioning . . . . . . . . . . . . . .
Comparator hysteresis . . . . . . . . . . . . .
RECEIVED SIGNAL MONITORING
4
5
5
6
9
10
11
11
SAMPLE POINT, DIGITAL SIGNAL
CONDITIONING, AND OUTPUT
CONFIGURATION
Digital filter . . . . . . . . . . . .
Sample point in time . . . . . . .
Switching matrix . . . . . . . . .
Output drivers . . . . . . . . . . .
SYSTEM CLOCK
STARTUP BEHAVIOR, OPERATING MODES,
AND STATUS REGISTER
Startup behavior and operating modes . . . .
Implemented commands . . . . . . . . . . . .
Status register . . . . . . . . . . . . . . . . .
POWER DOWN RESET
12
12
12
13
14
CHIP REVISION
SPI INTERFACE
APPLICATION NOTES
17
18
18
CONFIGURATION NOTES
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14
14
14
15
15
16
16
16
16
17
17
17
iC-LO
TRIANGULATION SENSOR
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PACKAGES
PIN CONFIGURATION oBGA™ LO1C
PIN FUNCTIONS
No. Name Function
A1
A3
B1
B3
C1
C3
D1
D3
E1
E3
F1
F3
G1
G2
G3
Physical dimensions see oBGA™ package specification LO1C.
MOSI
NSO
SCK
SO
MISO
WARN
NCS
NRES
GNDA
VDD
VCC
GND
VCCL
LED
GNDL
Master Output Slave Input
Antivalent Switching Output
SPI Clock
Switching Output
Master Input Slave Output
Warning Output
SPI Chip Select
Power-Down Reset
Analogue Ground
Digital Supply
Analogue Supply
Digital Ground
LED Driver Supply
LED Driver Output
LED Driver Ground
iC-LO
TRIANGULATION SENSOR
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ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item
No.
Symbol
Parameter
Supply Voltage at VCC, VDD
Voltage at digital inputs MOSI, SCK,
NCS
Current in WARN, NSO, SO, MISO,
MOSI, SCK, NCS, NRES, GND
Current in VCC, GNDA
Current in VDD
Current in VCCL
Current in LED
Current in GNDL
Chip-Temperature
Storage Temperature Range
ESD Susceptibility at all pins
see package specification
HBM 100 pF discharged through 1.5 kΩ
2
kV
Conditions
Min.
-0.3
-0.3
-40
-50
-40
-70
-40
-1600
-40
Max.
6
VDD +
0.3
40
50
70
40
1600
40
125
V
V
mA
mA
mA
mA
mA
mA
°C
Unit
G001 V()
G002 V()
G003 I()
G004 I()
G005 I()
G006 I()
G007 I()
G008 I()
G009 Tj
G010 Ts
G011 Vd()
THERMAL DATA
Operating Conditions: VDDA = VDD = 5 V ±10%
Item
No.
T01
Symbol
Ta
Parameter
Conditions
Min.
Operating Ambient Temperature Range see package specification
-40
Typ.
Max.
85
°C
Unit
All voltages are referenced to Pin GNDA unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.
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