1-KIS229-210TG datasheet, PDF - EEWORLD Datasheet

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1-KIS229-210TG: DescriptionIC Socket, PGA229, 229 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder; CategoryThe connector socket; File Size179KB，2 Pages; ManufacturerAdvanced Interconnections Corp.

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1-KIS229-210TG Overview

IC Socket, PGA229, 229 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

1-KIS229-210TG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	1.0 OZ. AVG. INSERTION FORCE
body width	1.9 inch
subject depth	0.015 inch
body length	1.9 inch
Contact structure	19X19
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	PGA229
Shell material	POLYAMIDE
JESD-609 code	e0
Manufacturer's serial number	KIS
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	229
Maximum operating temperature	400 °C
Minimum operating temperature	-269 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER

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Low Insertion Force

Peel-A-Way

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Peel-A-Way

Low Insertion Force PGA Sockets

Polyimide Film

.005

(.13)

Features:

• Disposable carriers peel away after

soldering.

• Peel-A-Way

tabs and full grid wafer

supplied on all Peel-A-Way

PGA sockets.

• Maximum air flow under PGA for greater

cooling.

• Better flux rinse and cleaning.

• Allows inspection of solder joints on both

sides of PCB.

• Lowest profile with use of type -210

terminal.

• Peel-A-Way

disposable socket terminal

carrier available in any configuration shown

or custom designed to meet your

specifications.

Footprint Dash #

If Applicable*

How To Order

068

-85

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Body Type

KS - 2.5 oz.(70.85 g) avg. insertion force

KIS - 1 oz.(28.34 g) avg. insertion force

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Polyimide Film

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

Peel away

after soldering

to PCB.

PCB

Solder fillets visible both sides

for inspection and cleaning.

Solder Preform:

63% Tin, 37% Lead

How To Use:

1. Place socket in PCB.

2. Send PCB and socket through soldering operation.

3. Peel away polyimide film carrier.

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Sealant Options

RTV

Seal

Body Material:

KS/KIS -

Polyimide Film

-269˚C to 400˚C (-452˚F to 752˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Peel-A-Way

covered by patent rights issued and/or pending.

Tape Sealed

To order: Add 3M to end of part #

Page 34

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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