K9F2808U0C-YCB0 datasheet, PDF

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K9F2808U0C-YCB0: DescriptionFlash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48; Categorystorage storage; File Size795KB，33 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K9F2808U0C-YCB0 Overview

Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

K9F2808U0C-YCB0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	TSOP1
package instruction	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	30 ns
Other features	CONTAINS ADDITIONAL 4M BIT NAND FLASH
command user interface	YES
Data polling	NO
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	18.4 mm
memory density	134217728 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	1K
Number of terminals	48
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
page size	512 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K
Maximum standby current	0.00005 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	SLC NAND TYPE
width	12 mm

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Advance

FLASH MEMORY

Document Title

16M x 8 Bit , 8M x 16 Bit NAND Flash Memory

Revision History

Revision No. History

0.0

1.0

Initial issue.

TBGA PKG Dimension Change

48-Ball, 6.0mm x 8.5mm --> 63-Ball, 9.0mm x 11.0mm

Draft Date

Apr. 15th 2002

Sep. 5th 2002

Remark

Advance

Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.

http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html

The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right

to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have

any questions, please contact the SAMSUNG branch office near you.

K9F2808U0C-YCB0 Related Products

	K9F2808U0C-YCB0	K9F2808Q0C-DIB0	K9F2808U0C-YIB0
Description	Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	Flash, 16MX8, 30ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, TBGA-63	Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	TSOP1	BGA	TSOP1
package instruction	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	9 X 11 MM, 0.80 MM PITCH, TBGA-63	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts	48	63	48
Reach Compliance Code	compliant	compliant	compliant
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	30 ns	30 ns	30 ns
Other features	CONTAINS ADDITIONAL 4M BIT NAND FLASH	CONTAINS ADDITIONAL 4M BIT NAND FLASH	CONTAINS ADDITIONAL 4M BIT NAND FLASH
command user interface	YES	YES	YES
Data polling	NO	NO	NO
JESD-30 code	R-PDSO-G48	R-PBGA-B63	R-PDSO-G48
length	18.4 mm	11 mm	18.4 mm
memory density	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	FLASH	FLASH	FLASH
memory width	8	8	8
Number of functions	1	1	1
Number of departments/size	1K	1K	1K
Number of terminals	48	63	48
word count	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C
organize	16MX8	16MX8	16MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	VFBGA	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20	BGA63,10X12,32	TSSOP48,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
page size	512 words	512 words	512 words
Parallel/Serial	PARALLEL	SERIAL	PARALLEL
power supply	3.3 V	1.8 V	3.3 V
Programming voltage	2.7 V	1.8 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES
Maximum seat height	1.2 mm	1 mm	1.2 mm
Department size	16K	16K	16K
Maximum standby current	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.02 mA	0.015 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	1.95 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	1.65 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	1.8 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	GULL WING
Terminal pitch	0.5 mm	0.8 mm	0.5 mm
Terminal location	DUAL	BOTTOM	DUAL
switch bit	NO	NO	NO
type	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE
width	12 mm	9 mm	12 mm
Is it Rohs certified?	incompatible	-	incompatible
JESD-609 code	e0	-	e0
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED

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