DB101 THRU DB107
Technical Data
Data Sheet N1778, Rev. A
DB101 THRU DB107
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER
Features
Glass passivated die construction
Low forward voltage drop
High current capability
High surge current capability
Plastic material-UL flammability 94V-0
This is a Pb − Free Device
“-HF” suffix is for Halogen Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
DB-M
Circuit Diagram
Mechanical Data
Case: DB-M, Molded plastic
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Polarity: as marked on case
Mounting Position: Any
Marking: Type Number
Lead Free: For RoHS / Lead Free Version
Maximum Ratings
@T
A
=25°C unless otherwise specified
Single Phase half wave 60Hz, resistive or inductive load. For capacitive load current derate by 20%.
Characteristic
DB101-HF THRU DB107-HF
Marking Code
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Output Current
(Note 1)
@ T
C
=100°C
Non-Repetitive Peak Forward Surge
Current 8.3ms Single half sine-wave
superimposed on rated load (JEDEC
Method)
I
2
t Rating for Fusing (t < 8.3ms)
Symbol DB101
DB102
DB103
DB104
DB105
DB106
DB107
Unit
DB101H DB102H DB103H DB104H DB105H DB106H DB107H
V
RRM
V
RWM
V
R
V
RMS
I
F(AV)
50
35
100
70
200
140
400
280
1.0
600
420
800
560
1000
700
V
V
A
I
FSM
45
A
I
2
t
8.404
A
2
s
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DB101 THRU DB107
Technical Data
Data Sheet N1778, Rev. A
Electrical Characteristics
@T
A
=25°C unless otherwise specified
:
Characteristic
DB101-HF THRU DB107-HF
Marking Code
Maximum Forward Voltage Drop
per Bridge Element @I
F
=1.0A, T
J
=25°C
Peak Reverse Current
@T
A
= 25°C
At Rated DC Blocking Voltage @T
A
= 125°C
Typical Junction Capacitance (Note 2)
* Pulse width < 300 µs, duty cycle < 2%
Symbol
DB101
DB102
DB103
DB104
DB105
DB106
DB107
Unit
DB101H DB102H DB103H DB104H DB105H DB106H DB107H
V
F
I
R
C
J
1.0
5
200
25
V
μA
pF
Thermal-Mechanical Specifications:
Characteristic
DB101-HF THRU DB107-HF
Marking Code
Typical Thermal Resistance Junction to
Ambient
Typical Thermal Resistance Junction to Lead
Symbol
DB101
DB102
DB103
DB104
DB105
DB106
DB107
Unit
DB101H DB102H DB103H DB104H DB105H DB106H DB107H
R
θJA
R
θJL
40
15
-55+150
°C/W
°C/W
°C
Operating Junction and Storage Temperature
T
J ,
T
STG
Range
Note: 1. Mounted on glass epoxy PC board with 1.3mm
2
solder pad.
2. Measured at 1.0 MHZ and applied reverse voltage of 4.0 VDC
Ratings and Characteristics Curves
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DB101 THRU DB107
Technical Data
Data Sheet N1778, Rev. A
Mechanical Dimensions DB-M(Inches/Millimeters)
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DB101 THRU DB107
Technical Data
Data Sheet N1778, Rev. A
Marking Diagram
Where XXXXX is YYWWL
DB101
DB101H
YY
WW
L
= Type Number
= Marking Code
= Year
= Week
= Lot Number
Cautions：Molding
resin
Epoxy resin UL:94V-0
DB101
DB101-HF
Ordering Information
Device
DB101 THRU DB107
Package
DB-M
Plating
Pure Sn
Shipping
50pcs / tube
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging
specification.
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DB101 THRU DB107
Technical Data
Data Sheet N1778, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of
the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall
SMC Diode Solutions
be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s).
SMC Diode Solution
assumes no responsibility for any intellectual property
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall
SMC Diode Solutions
be liable for any failure in a semiconductor device or any secondary damage resulting from use
at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or
SMC Diode Solutions.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of
SMC
Diode Solutions.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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