HYM72V8025GS-50 datasheet, PDF

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HYM72V8025GS-50: DescriptionEDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168; Categorystorage storage; File Size66KB，11 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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HYM72V8025GS-50 Overview

EDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168

HYM72V8025GS-50 Parametric

Parameter Name	Attribute value
Maker	Infineon
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	603979776 bit
Memory IC Type	EDO DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	33.02 mm
Maximum standby current	0.03 A
Maximum slew rate	1.8 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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72-Bit EDO- DRAM Module

(ECC - Module)

168 pin buffered DIMM Module

HYM 72V8025GS-50/-60

HYM 72V8035GS-50/-60

•

168 pin JEDEC Standard, Buffered 8 Byte Dual In-Line Memory Module

for PC main memory applications

1 bank 8 M x 72 organisation

Optimized for ECC applications

Hyper Page Mode - EDO Operation

Performance:

-50

tRAC

tCAC

tAA

tRC

tHPC

RAS Access Time

CAS Access Time

Access Time from Address

Cycle Time

EDO Mode Cycle Time

50 ns

18 ns

30 ns

84 ns

20 ns

-60

60 ns

20 ns

35 ns

104 ns

25 ns

•

Single + 3.3V

0.3 V supply

CAS-before-RAS refresh, RAS-only refresh

Decoupling capacitors mounted on substrate

All inputs, outputs and clock fully LVTTL & LVCMOS compatible

4 Byte interleave enabled, Dual Address inputs (A0/B0)

Buffered inputs excepts RAS and DQ

Parallel Presence Detects

Utilizes nine 8M

8 -DRAMs and BiCMOS buffers/line drivers VT244A

Two versions: HYM 72V8035GS with SOJ-components ( 9 mm module thickness)

HYM 72V8025GS with TSOPII-components ( 4 mm module thickness)

4048 refresh cycles / 64 ms with 12 / 11 addressing

Gold contact pad

Double sided module with 25.35 mm (1000 mil) height

•

Semiconductor Group

3.97

HYM72V8025GS-50 Related Products

	HYM72V8025GS-50	HYM72V8035GS-50	HYM72V8035GS-60	HYM72V8025GS-60
Description	EDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168	EDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168	EDO DRAM Module, 8MX72, 60ns, CMOS, DIMM-168	EDO DRAM Module, 8MX72, 60ns, CMOS, DIMM-168
Maker	Infineon	Infineon	Infineon	Infineon
Parts packaging code	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168	168	168
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	50 ns	50 ns	60 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	603979776 bit	603979776 bit	603979776 bit	603979776 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	72	72	72	72
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	168	168	168	168
word count	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	8MX72	8MX72	8MX72	8MX72
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096
Maximum seat height	33.02 mm	33.02 mm	33.02 mm	33.02 mm
Maximum standby current	0.03 A	0.03 A	0.03 A	0.03 A
Maximum slew rate	1.8 mA	1.8 mA	1.62 mA	1.62 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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