Memory IC
| Parameter Name | Attribute value |
| Maker | FUJITSU |
| Parts packaging code | SOIC |
| package instruction | , |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| MB841000-80LPF | MB841000-10PF | MB841000-80PF | MB841000-12LPF | MB841000-12PF | MB841000-12LP | MB841000-80LP | |
|---|---|---|---|---|---|---|---|
| Description | Memory IC | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 80ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 120ns, CMOS, PDIP32 | Standard SRAM, 128KX8, 80ns, CMOS, PDIP32 |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | DIP |
| package instruction | , | SOP, SOP32,.56 | SOP, SOP32,.56 | SOP, SOP32,.56 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Maker | FUJITSU | FUJITSU | FUJITSU | FUJITSU | FUJITSU | FUJITSU | - |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maximum access time | - | 100 ns | 80 ns | 120 ns | 120 ns | 120 ns | 80 ns |
| I/O type | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | - | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | - | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | - | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | - | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | SOP | SOP | SOP | SOP | DIP | DIP |
| Encapsulate equivalent code | - | SOP32,.56 | SOP32,.56 | SOP32,.56 | SOP32,.56 | DIP32,.6 | DIP32,.6 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | - | 0.0005 A | 0.0005 A | 0.0001 A | 0.0005 A | 0.0001 A | 0.0001 A |
| Minimum standby current | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | - | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | YES | YES | YES | YES | NO | NO |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |