Standard SRAM, 64KX1, 12ns, ECL, CDIP22, 0.300 INCH, CERDIP-22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.3 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 12 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-GDIP-T22 |
| JESD-609 code | e0 |
| length | 27.18 mm |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 22 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 64KX1 |
| Output characteristics | OPEN-EMITTER |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.84 mm |
| Maximum slew rate | 0.14 mA |
| surface mount | NO |
| technology | ECL |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| HM101490-12 | HM101490-10 | |
|---|---|---|
| Description | Standard SRAM, 64KX1, 12ns, ECL, CDIP22, 0.300 INCH, CERDIP-22 | Standard SRAM, 64KX1, 10ns, ECL, CDIP22, 0.300 INCH, CERDIP-22 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | Hitachi （Renesas ） |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, DIP22,.3 | DIP, DIP22,.3 |
| Contacts | 22 | 22 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 12 ns | 10 ns |
| I/O type | SEPARATE | SEPARATE |
| JESD-30 code | R-GDIP-T22 | R-GDIP-T22 |
| JESD-609 code | e0 | e0 |
| length | 27.18 mm | 27.18 mm |
| memory density | 65536 bit | 65536 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 |
| Negative supply voltage rating | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 22 | 22 |
| word count | 65536 words | 65536 words |
| character code | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C |
| organize | 64KX1 | 64KX1 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER |
| Exportable | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP22,.3 | DIP22,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | -5.2 V | -5.2 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.84 mm | 5.84 mm |
| Maximum slew rate | 0.14 mA | 0.14 mA |
| surface mount | NO | NO |
| technology | ECL | ECL |
| Temperature level | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm |
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