EL13D8D2F-187.500M
Series
RoHS Compliant (Pb-free) 6 Pad 5mm x 7mm Ceramic
SMD 3.3Vdc LVDS Oscillator
Frequency Tolerance/Stability
±50ppm Maximum over 0°C to +70°C
Duty Cycle
50 ±5(%)
RoHS
Pb
EL13D8 D 2 F -187.500M
Nominal Frequency
187.500MHz
Logic Control / Additional Output
Tri-State (High Impedance) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
187.500MHz
±50ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year
Aging at 25°C, Shock, and Vibration)
3.3Vdc ±5%
85mA Maximum (with Load)
1.45Vdc Typical, 1.6Vdc Maximum
1.1Vdc Typical, 0.9Vdc Minimum
-50mV Minimum, +50mV Maximum
247mV Minimum, 350mV Typical, 454mV Maximum
1.125Vdc Minimum, 1.250Vdc Typical, 1.375Vdc Maximum
300pSec Typical, 600pSec Maximum (Measured over 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
-150mV Minimum, +150mV Maximum
100 Ohms (Between Output and Complementary Output)
LVDS
-60dBc/Hz at 10Hz offset, -90dBc/Hz at 100Hz offset, -115dBc/Hz at 1kHz offset, -129dBc/Hz at 10kHz
offset, -130dBc/Hz at 100kHz offset, -131dBc/Hz at 1MHz offset, -148dBc/Hz at 10MHz offset (Typical
Values, Fo = 156.250MHz)
Tri-State (High Impedance) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output, Vil of 30% of Vcc to Disable Output (High
Impedance)
600µA Maximum (Disabled Output, High Impedance, without Load)
0.7pSec Typical, 1pSec Maximum (Fj = 12kHz to 20MHz)
10mSec Maximum
-55°C to +125°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Vod Magnitude Change (dVod)
Differential Output Voltage (Vod)
Offset Voltage (Vos)
Rise/Fall Time
Duty Cycle
Vos Magnitude Change (dVos)
Load Drive Capability
Output Logic Type
Phase Noise
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Standby Current
RMS Phase Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/17/2010 | Page 1 of 5
EL13D8D2F-187.500M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/17/2010 | Page 5 of 5
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