|
TMS320C6201GGPA-167 |
TMS320C6201GGP-200 |
TMS320C6201BGJLA-200 |
TMS320C6201GGP-233 |
TMS320C6201GGP-167 |
TMS320C6201BGA |
TMS320C6201BGJL-167 |
| Description |
32-BIT, 167MHz, OTHER DSP, PBGA352 |
32-BIT, 200MHz, OTHER DSP, PBGA352, PLASTIC, BGA-352 |
32-BIT, 200MHz, OTHER DSP, PBGA352 |
32-BIT, 233MHz, OTHER DSP, PBGA352 |
32-BIT, 167MHz, OTHER DSP, PBGA352, PLASTIC, BGA-352 |
32-BIT, 200MHz, OTHER DSP, PBGA352, BGA-352 |
32-BIT, 167MHz, OTHER DSP, PBGA352 |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
HBGA, |
LBGA, |
HBGA, |
HBGA, |
LBGA, |
LBGA, |
HBGA, BGA352,26X26,40 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
not_compliant |
| Address bus width |
22 |
22 |
22 |
22 |
22 |
23 |
22 |
| barrel shifter |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| boundary scan |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| maximum clock frequency |
167 MHz |
200 MHz |
200 MHz |
233 MHz |
167 MHz |
200 MHz |
167 MHz |
| External data bus width |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
| Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
| Internal bus architecture |
SINGLE |
MULTIPLE |
SINGLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PBGA-B352 |
S-PBGA-B352 |
S-PBGA-B352 |
S-PBGA-B352 |
S-PBGA-B352 |
S-PBGA-B352 |
S-PBGA-B352 |
| length |
35 mm |
35 mm |
27 mm |
35 mm |
35 mm |
35 mm |
27 mm |
| low power mode |
NO |
YES |
NO |
YES |
YES |
YES |
YES |
| Number of terminals |
352 |
352 |
352 |
352 |
352 |
352 |
352 |
| Maximum operating temperature |
105 °C |
90 °C |
105 °C |
90 °C |
90 °C |
90 °C |
90 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HBGA |
LBGA |
HBGA |
HBGA |
LBGA |
LBGA |
HBGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, HEAT SINK/SLUG |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, HEAT SINK/SLUG |
GRID ARRAY, HEAT SINK/SLUG |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, HEAT SINK/SLUG |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.7 mm |
1.7 mm |
3.8 mm |
1.7 mm |
1.7 mm |
1.7 mm |
3.8 mm |
| Maximum supply voltage |
2.62 V |
1.89 V |
1.89 V |
2.62 V |
1.89 V |
3.46 V |
1.89 V |
| Minimum supply voltage |
2.38 V |
1.71 V |
1.71 V |
2.38 V |
1.71 V |
2.38 V |
1.71 V |
| Nominal supply voltage |
2.5 V |
1.8 V |
1.8 V |
2.5 V |
1.8 V |
3.3 V |
1.8 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
OTHER |
INDUSTRIAL |
OTHER |
OTHER |
OTHER |
OTHER |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
1.27 mm |
1.27 mm |
1 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| width |
35 mm |
35 mm |
27 mm |
35 mm |
35 mm |
35 mm |
27 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
| ECCN code |
3A001.A.3 |
- |
3A001.A.3 |
3A001.A.3 |
- |
3A001.A.3 |
3A001.A.3 |
| Other features |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
- |
ALSO REQUIRES 3.3V SUPPLY |
- |
- |