MT28C64416W18ABW-F705BWT datasheet, PDF

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MT28C64416W18ABW-F705BWT: DescriptionMemory Circuit, 4MX16, CMOS, PBGA77, LEAD FREE, FBGA-77; Categorystorage storage; File Size178KB，13 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT28C64416W18ABW-F705BWT Overview

Memory Circuit, 4MX16, CMOS, PBGA77, LEAD FREE, FBGA-77

MT28C64416W18ABW-F705BWT Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	77
Reach Compliance Code	unknown
Other features	CELLULARRAM IS ORGANIZED AS 1M X 16
JESD-30 code	R-PBGA-B77
JESD-609 code	e1
length	10 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	77
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm

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PRELIMINARY

‡

64Mb MULTIBANK ASYNC/PAGE OR BURST FLASH

16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM

FLASH AND

COMBO MEMORY

Features

CellularRAM

™

MT28C64416W18/W30A (PREVIEW

‡‡

)

MT28C64432W18/W30A

MT28C64464W18/W30A

Low Voltage, Wireless Temperature

Stacked die Combo package

• Includes one 64Mb Flash device

• Choice of either 16Mb, 32Mb, or 64Mb Cellular-

RAM device

Basic configuration

Flash

• Flexible multibank architecture

• 4 Meg x 16 Async/Page/Burst interface

• Support for true concurrent operations with no

latency

CellularRAM

• Low-power, high-density design

• 1 Meg x 16, 2 Meg x 16, or 4 Meg x 16 configurations

• Async/Page

F_V

, V

Q, F_V

, C_V

voltages

• 1.70V (MIN)/1.95V (MAX) F_V

, C_V

• 1.70V (MIN)/2.24V (MAX) V

Q (W18)

• 2.20V (MIN)/3.30V(MAX) V

Q (W30)

• 1.80V (TYP) F_V

(in-system PROGRAM/ERASE)

• 12V ±5% (HV) F_V

tolerant (factory programming

compatibility)

Fast programming Algorithm (FPA)

Enhanced suspend options

• ERASE-SUSPEND-to-READ within same bank

• PROGRAM-SUSPEND-to-READ within same bank

• ERASE-SUSPEND-to-PROGRAM within same bank

Flash device contains two 64-bit chip protection registers

for security purposes

100,000 ERASE cycles per block

Cross-compatible command set support

• Extended command set

• Common Flash interface (CFI) compliant

Manufacturer’s Identification Code (ManID)

• Micron

• Intel

preview

status.

The

MT28C64432W18/W30A and MT28C64464W18/W30A are

preliminary status.

††

MT28C64416W18/W30A

Figure 1: 77-Ball FBGA

A18

A19

C_VSS

F_VCC

A21

A11

C_LB#

C_VSS

F_CLK

A12

A17

F_VPP

C_WE#

C_CE#

A13

F_WP#

F_ADV#

A20

A10

A15

C_UB#

F_RST#

F_WE#

A14

A16

DQ8

DQ2

DQ10

DQ5

DQ13

F_WAIT#

C_OE#

DQ0

DQ1

DQ3

DQ12

DQ14

DQ7

F_OE#

DQ9

DQ11

DQ4

DQ6

DQ15

VCCQ

F_CE#

C_VCC

F_VCC

VCCQ

C_ZZ#

C_VSS

VSSQ

VCCQ

F_VCC

C_VSS

VSSQ

F_VSS

C_VSS

Top View

(Ball Down)

NOTE:

Balls B6, D5, and F7 are only used for Flash burst operation.

Options

Flash Timing

• 60ns

(W18)

• 70ns (W18/W30)

Flash Burst Frequency

• 66 MHz

(W18)

• 54 MHz (W18/W30)

Flash Boot Block Configuration

Top

Bottom

CellularRAM Timing

• 70ns

• 85ns

I/O Voltage Range

• VccQ 1.70V–2.24V (W18)

• VccQ 2.20V–3.30V (W30)

Manufacturer’s Identification Code (ManID)

• Micron (0x2Ch)

• Intel (0x89h)

Operating Temperature Range

• Wireless Temperature (-25°C to +85°C)

Package

• 77-ball (Standard) FBGA 8 x 10 grid

• 77-ball (Lead-free) FBGA 8 x 10 grid

NOTE:

1. Contact factory for availability.

2. Contact factory for details.

09005aef80c9c807

MT28C64432W18A.fm - Rev. E Pub 2/04 EN

‡

PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS

‡‡

ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.

THIS DATA SHEET CONTAINS THE PRESENT DESCRIPTION OF A PRODUCT IN

DEFINITION WITH NO FORMAL DESIGN IN PROGRESS.

PRELIMINARY

64Mb MULTIBANK ASYNC/PAGE OR BURST FLASH

16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM

Table of Contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Device General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

CellularRAM General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

MultiChip Packaging Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Unique IDs, State Machines, and Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

WAIT Ball Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Data Sheet Designation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

09005aef80c9c807

MT28C64432W18A.fm - Rev. E Pub 2/04 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

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