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SM8S26A2D

Description
Trans Voltage Suppressor Diode, 5200W, 26V V(RWM), Unidirectional, 1 Element, Silicon, DO-218AB
CategoryDiscrete semiconductor    diode   
File Size63KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

SM8S26A2D Overview

Trans Voltage Suppressor Diode, 5200W, 26V V(RWM), Unidirectional, 1 Element, Silicon, DO-218AB

SM8S26A2D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerVishay
package instructionR-PSSO-C1
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresPATENTED DEVICE
Maximum breakdown voltage31.9 V
Minimum breakdown voltage28.9 V
Breakdown voltage nominal value30.4 V
Shell connectionANODE
Maximum clamping voltage42.1 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-218AB
JESD-30 codeR-PSSO-C1
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation5200 W
Number of components1
Number of terminals1
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation8 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage26 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formC BEND
Terminal locationSINGLE
SM8S Series
Surface Mount Automotive
Transient Voltage Suppressors
DO-218AB
0.628(16.0)
0.592(15.0)
0.539(13.7)
0.524(13.3)
0.116(3.0)
0.093(2.4)
0.413(10.5) 0.342(8.7)
0.374(9.5) 0.327(8.3)
ct
odu *
Pr ed
ew ent
N t
Pa
0.413(10.5)
0.374(9.5)
Stand-off Voltage
10 to 36V
Peak Pulse Power
6600W (10/1000µs)
5200W (10/10,000µs)
Mounting Pad Layout
0.091(2.3)
0.067(1.7)
0.366(9.3)
0.343(8.7)
0.406(10.3)
0.382(9.7)
0.116(3.0)
0.093(2.4)
Dimensions in
inches and (millimeters)
LEAD 1
0.197(5.0)
0.185(4.7)
0.138(3.5)
0.098(2.5)
0.366(9.3)
0.343(8.7)
0.606(15.4)
0.583(14.8)
0.150(3.8)
0.126(3.2)
0.016 (0.4) Min.
0.028(0.7)
0.020(0.5)
0.098(2.5)
0.059(1.5)
*
Patent #’s:
4,980,315
5,166,769
5,278,095
LEAD 2/METAL HEATSINK
Mechanical Data
Case:
Molded plastic body, surface mount with heatsink
integrally mounted in the encapsulation
Terminals:
Plated, solderable per MIL-STD-750, Method 2026
Polarity:
Heatsink is anode
Mounting Position:
Any
Weight:
0.091oz., 2.58g
Packaging codes/options:
2D/750 per 13” Reel (16mm Tape),
anode towards sprocket hole, 4.5K/box
2E/750 per 13” Reel (16mm Tape),
cathode towards sprocket hole, 4.5K/box
Features
• Ideally suited for load dump protection
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• High temperature stability due to unique oxide passiva-
tion and patented PAR
®
construction
• Integrally molded heatsink provides a very low thermal
resistance for maximum heat dissipation
• Low leakage current at T
J
= 175°C
• High temperature soldering guaranteed:
260°C for 10 seconds at terminals
• Meets ISO7637-2 surge spec.
• Low forward voltage drop
Maximum Ratings and Thermal Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Peak pulse power dissipation with 10/1000µs waveform
10/10,000µs waveform
Steady state power dissipation
Peak pulse current with a 10/1000µs waveform
(1)
Peak forward surge current, 8.3ms single half sine-wave
Typical thermal resistance junction to case
Operating junction and storage temperature range
Notes:
(1) Non-repetitive current pulse derated above T
A
=25°C
Symbol
P
PPM
P
D
I
PPM
I
FSM
R
θJC
T
J
, T
STG
Value
6600
5200
8.0
See Table 1
700
0.90
-55 to +175
Unit
W
W
A
A
°C/W
°C
8/28/01
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