MASK ROM, 4MX8, 200ns, CMOS, PQFP64, QFP-64
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | QFP |
| package instruction | QFP, QFP64,.7X.95,40 |
| Contacts | 64 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| Spare memory width | 16 |
| JESD-30 code | R-PQFP-G64 |
| JESD-609 code | e0 |
| length | 20 mm |
| memory density | 33554432 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP64,.7X.95,40 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.75 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| KM23C32100FP-20 | KM23C32100FP-15 | KM23C32100FP-25 | |
|---|---|---|---|
| Description | MASK ROM, 4MX8, 200ns, CMOS, PQFP64, QFP-64 | MASK ROM, 4MX8, 150ns, CMOS, PQFP64, QFP-64 | MASK ROM, 4MX8, 250ns, CMOS, PQFP64, QFP-64 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG |
| Parts packaging code | QFP | QFP | QFP |
| package instruction | QFP, QFP64,.7X.95,40 | QFP, QFP64,.7X.95,40 | QFP, QFP64,.7X.95,40 |
| Contacts | 64 | 64 | 64 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 150 ns | 250 ns |
| Spare memory width | 16 | 16 | 16 |
| JESD-30 code | R-PQFP-G64 | R-PQFP-G64 | R-PQFP-G64 |
| JESD-609 code | e0 | e0 | e0 |
| length | 20 mm | 20 mm | 20 mm |
| memory density | 33554432 bit | 33554432 bit | 33554432 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 64 |
| word count | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 4MX8 | 4MX8 | 4MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QFP |
| Encapsulate equivalent code | QFP64,.7X.95,40 | QFP64,.7X.95,40 | QFP64,.7X.95,40 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.75 mm | 2.75 mm | 2.75 mm |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.1 mA | 0.1 mA | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1 mm | 1 mm | 1 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 14 mm | 14 mm | 14 mm |
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