PC28F128P30B85E datasheet, PDF

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PC28F128P30B85E: DescriptionFlash, 8MX16, 85ns, PBGA64; Categorystorage storage; File Size1MB，97 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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PC28F128P30B85E Overview

Flash, 8MX16, 85ns, PBGA64

PC28F128P30B85E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	BGA, BGA64,8X8,40
Reach Compliance Code	compliant
Maximum access time	85 ns
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	S-PBGA-B64
memory density	134217728 bit
Memory IC Type	FLASH
memory width	16
Number of departments/size	4,127
Number of terminals	64
word count	8388608 words
character code	8000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	SQUARE
Package form	GRID ARRAY
page size	4 words
Parallel/Serial	PARALLEL
power supply	1.8,1.8/3.3 V
Certification status	Not Qualified
Department size	16K,64K
Maximum standby current	0.000075 A
Maximum slew rate	0.051 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	NO
type	NOR TYPE

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Numonyx™ StrataFlash

(P30)

Embedded Memory

Datasheet

Product Features

High performance

— 85 ns initial access

— 52 MHz with zero wait states, 17ns clock-to-data output

synchronous-burst read mode

— 25 ns asynchronous-page read mode

— 4-, 8-, 16-, and continuous-word burst mode

— Buffered Enhanced Factory Programming (BEFP) at 5

μs/

byte (Typ)

— 1.8 V buffered programming at 7

μs/byte

(Typ)

— Multi-Level Cell Technology: Highest Density at Lowest

Cost

— Asymmetrically-blocked architecture

— Four 32-KByte parameter blocks: top or bottom

configuration

— 128-KByte main blocks

Security

— One-Time Programmable Registers:

• 64 unique factory device identifier bits

• 2112 user-programmable OTP bits

— Selectable OTP Space in Main Array:

• Four pre-defined 128-KByte blocks (top or bottom

configuration)

• Up to Full Array OTP Lockout

— Absolute write protection: V

= V

— Power-transition erase/program lockout

— Individual zero-latency block locking

— Individual block lock-down

Architecture

Software

— 20

μs

(Typ) program suspend

— 20

μs

(Typ) erase suspend

— Numonyx™ Flash Data Integrator optimized

— Basic Command Set and Extended Command Set

compatible

— Common Flash Interface capable

Voltage and Power

— V

(core) voltage: 1.7 V – 2.0 V

— V

CCQ

(I/O) voltage: 1.7 V – 3.6 V

— Standby current: 20μA (Typ) for 64-Mbit

— 4-Word synchronous read current:

13 mA (Typ) at 40 MHz

Quality and Reliability

— Operating temperature: –40 °C to +85 °C

— Minimum 100,000 erase cycles per block

— ETOX™ VIII process technology

Density and Packaging

— 56- Lead TSOP package (64, 128, 256,

512- Mbit)

— 64- Ball Numonyx™ Easy BGA package (64,

128, 256, 512- Mbit)

— Numonyx™ QUAD+ SCSP (64, 128, 256,

512- Mbit)

— 16-bit wide data bus

306666-12

August 2008

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx

products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Legal L ines and D isc laim er s

Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.

Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented

subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or

otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting

Numonyx's website at

http://www.numonyx.com.

Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

August 2008

306666-12

P30

Contents

1.0

Functional Description

............................................................................................... 5

1.1

Introduction ....................................................................................................... 5

1.2

Overview ........................................................................................................... 5

1.3

Virtual Chip Enable Description.............................................................................. 6

1.4

Memory Maps ..................................................................................................... 6

Package Information

................................................................................................. 9

2.1

56-Lead TSOP..................................................................................................... 9

2.2

64-Ball Easy BGA Package .................................................................................. 10

2.3

QUAD+ SCSP Packages ...................................................................................... 12

Ballouts

................................................................................................................... 15

Signals

.................................................................................................................... 18

4.1

Dual-Die Configurations ..................................................................................... 20

Bus Operations

........................................................................................................ 21

5.1

Reads .............................................................................................................. 21

5.2

Writes.............................................................................................................. 21

5.3

Output Disable.................................................................................................. 21

5.4

Standby ........................................................................................................... 22

5.5

Reset............................................................................................................... 22

Command Set

.......................................................................................................... 23

6.1

Device Command Codes..................................................................................... 23

6.2

Device Command Bus Cycles .............................................................................. 24

Read

7.1

7.2

7.3

7.4

Operation........................................................................................................

Asynchronous Page-Mode Read ........................................................................... 26

Synchronous Burst-Mode Read............................................................................ 26

Read Device Identifier........................................................................................ 27

Read CFI.......................................................................................................... 27

2.0

3.0

4.0

5.0

6.0

7.0

8.0

Program Operation

.................................................................................................. 28

8.1

Word Programming ........................................................................................... 28

8.2

Factory Word Programming ................................................................................ 29

8.3

Buffered Programming ....................................................................................... 29

8.4

Buffered Enhanced Factory Programming.............................................................. 30

8.4.1 BEFP Requirements and Considerations ..................................................... 30

8.4.2 BEFP Setup Phase .................................................................................. 31

8.4.3 BEFP Program/Verify Phase ..................................................................... 31

8.4.4 BEFP Exit Phase ..................................................................................... 32

8.5

Program Suspend .............................................................................................. 32

8.6

Program Resume............................................................................................... 32

8.7

Program Protection............................................................................................ 33

Erase Operations

..................................................................................................... 34

9.1

Block Erase ...................................................................................................... 34

9.2

Erase Suspend .................................................................................................. 34

9.3

Erase Resume................................................................................................... 35

9.4

Erase Protection ................................................................................................ 35

9.0

10.0 Security Modes

........................................................................................................ 36

10.1 Block Locking.................................................................................................... 36

10.1.1 Lock Block............................................................................................. 36

10.1.2 Unlock Block.......................................................................................... 36

August 2008

306666-12

Datasheet

P30

10.2

10.1.3 Lock-Down Block ....................................................................................36

10.1.4 Block Lock Status ...................................................................................37

10.1.5 Block Locking During Suspend ..................................................................37

Selectable One-Time Programmable Blocks ...........................................................38

11.0 Registers

.................................................................................................................39

11.1 Read Status Register..........................................................................................39

11.1.1 Clear Status Register ..............................................................................40

11.2 Read Configuration Register ................................................................................40

11.2.1 Read Mode.............................................................................................41

11.2.2 Latency Count ........................................................................................41

11.2.3 WAIT Polarity .........................................................................................43

11.2.4 Data Hold ..............................................................................................44

11.2.5 WAIT Delay............................................................................................44

11.2.6 Burst Sequence ......................................................................................45

11.2.7 Clock Edge.............................................................................................45

11.2.8 Burst Wrap ............................................................................................46

11.2.9 Burst Length ..........................................................................................46

11.2.10 End of Word Line (EOWL) Considerations ...................................................46

11.3 One-Time-Programmable (OTP) Registers .............................................................46

11.3.1 Reading the OTP registers........................................................................47

11.3.2 Programming the OTP Registers................................................................48

11.3.3 Locking the OTP Registers........................................................................48

12.0 Power and Reset Specifications

...............................................................................49

12.1 Power-Up and Power-Down .................................................................................49

12.2 Reset Specifications ...........................................................................................49

12.3 Power Supply Decoupling ....................................................................................50

13.0 Maximum Ratings and Operating Conditions

............................................................51

13.1 Absolute Maximum Ratings .................................................................................51

13.2 Operating Conditions..........................................................................................51

14.0 Electrical Specifications

...........................................................................................52

14.1 DC Current Characteristics ..................................................................................52

14.2 DC Voltage Characteristics ..................................................................................53

15.0 AC Characteristics

....................................................................................................54

15.1 AC Test Conditions.............................................................................................54

15.2 Capacitance ......................................................................................................55

15.3 AC Read Specifications .......................................................................................55

15.4 AC Write Specifications .......................................................................................62

16.0 Program and Erase Characteristics...........................................................................66

17.0 Ordering Information

...............................................................................................67

17.1 Discrete Products...............................................................................................67

17.2 SCSP Products...................................................................................................68

Supplemental Reference Information.......................................................................69

Conventions - Additional Information

......................................................................94

Revision History.......................................................................................................96

Datasheet

August 2008

306666-12

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Description	Flash, 8MX16, 85ns, PBGA64	Flash, 8MX16, 85ns, PBGA64	Flash, 4MX16, 85ns, PBGA64	Flash, 16MX16, 95ns, PDSO56	Flash, 4MX16, 85ns, PBGA64	Flash, 16MX16, 85ns, PBGA64	Flash, 4MX16, 85ns, PBGA64	Flash, 16MX16, 85ns, PBGA64	Flash, 16MX16, 85ns, PBGA64
Is it Rohs certified?	conform to	conform to	incompatible	conform to	conform to	conform to	conform to	conform to	incompatible
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant	compliant	compliant	unknown
Maximum access time	85 ns	85 ns	85 ns	95 ns	85 ns	85 ns	85 ns	85 ns	85 ns
startup block	BOTTOM	TOP	BOTTOM	BOTTOM	TOP	TOP	BOTTOM	BOTTOM	TOP
command user interface	YES	YES	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	R-PDSO-G56	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	R-PBGA-B64	S-PBGA-B64
memory density	134217728 bit	134217728 bit	67108864 bit	268435456 bit	67108864 bit	268435456 bit	67108864 bit	268435456 bit	268435456 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16	16
Number of departments/size	4,127	4,127	4,63	4,255	4,63	4,255	4,63	4,255	4,255
Number of terminals	64	64	64	56	64	64	64	64	64
word count	8388608 words	8388608 words	4194304 words	16777216 words	4194304 words	16777216 words	4194304 words	16777216 words	16777216 words
character code	8000000	8000000	4000000	16000000	4000000	16000000	4000000	16000000	16000000
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8MX16	8MX16	4MX16	16MX16	4MX16	16MX16	4MX16	16MX16	16MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	TSSOP	BGA	BGA	BGA	TBGA	BGA
Encapsulate equivalent code	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40
Package shape	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY, THIN PROFILE	GRID ARRAY
page size	4 words	4 words	4 words	4 words	4 words	4 words	4 words	4 words	4 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Department size	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K
Maximum standby current	0.000075 A	0.000075 A	0.000035 A	0.000115 A	0.000035 A	0.000115 A	0.000035 A	0.000115 A	0.000115 A
Maximum slew rate	0.051 mA	0.051 mA	0.028 mA	0.051 mA	0.028 mA	0.051 mA	0.028 mA	0.051 mA	0.051 mA
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	GULL WING	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
switch bit	NO	NO	NO	NO	NO	NO	NO	NO	NO
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Maker	Micron Technology	-	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
package instruction	BGA, BGA64,8X8,40	BGA, BGA64,8X8,40	-	TSSOP, TSSOP56,.8,20	BGA, BGA64,8X8,40	BGA, BGA64,8X8,40	BGA, BGA64,8X8,40	TBGA, BGA64,8X8,40	-

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