REVISION E
DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
"A" REF
"B" REF
"C" REF
10.76 .424 REF
BEC5-XXX-XX-X-X-V-A-XX-TR
No OF POSITIONS
-060, -080, -100, -120, -140,
-160, -180, -200
(SEE NOTE 6)
CARD THICKNESS
-02 (1.57mm [.062] PCB)
(USE SUB-IM-C-270-02-X-X)
-03 (2.36 mm [0.93] PCB)
(USE SUB-IM-C-270-03-X-X)
9.00 .354
REF
PLATING SPECIFICATION
-L: 10 µ" SELECTIVE GOLD, MATTE TIN ON TAIL
(USE SUB-IM-C-270-XX-L-X)
-S: 30 µ" SELECTIVE GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-270-XX-S-X)
PACKAGING
-TR: TAPE & REEL
OPTIONS
-K: POLYIMIDE FILM
(SEE FIG. 2, SHT 2)
ALIGNMENT PINS
-A: ALIGMENT PINS
VERTICAL
DO NOT
SCALE FROM
THIS PRINT
PIN 02
"D"
REF
1.00 .039
REF
"A"
'B'
PIN 01
"E"
(SEE NOTE 8)
C
"A"
C
SOLDER COMPOSTION & STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-270-XX-X-1)
-2: 96.5% TIN / 3.5% SILVER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-270-XX-X-2)
BEC5-XXX-XX-V-XX
0.51 .020 (TYP)
TOL NON-ACCUM
1.18 .046
13.00 .512
REF
SEE NOTE 5
PIN 04
(TOP)
"C"
PIN 04
(TOP)
PIN 03
(BOTTOM)
"C"
PIN 03
(BOTTOM)
2.43 .096
REF
SUB-IM-C-270-XX-X-X
(SEE NOTE 11)
"F"
(SEE NOTE 9)
WT-16-04-T
1.86 .073
(2 PLCS)
C
PIN 01
(TOP)
1.32 .052
REF
1.000 .039
(TYP) NON ACCUM
C
PIN 02
(BOTTOM)
1.32 .052 REF
C
L
NOTES:
DETAIL 'B'
SCALE 4 : 1
6.00 .236
0.64 .025
REF (TYP)
C
1.10 .043 REF
"J"±0.20
C
"H" REF
1.
C
REPRESENTS A CRITICAL DIMENSION.
SCALE 4 : 1
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB].
3. PARTS TO BE PACKAGED IN TAPE AND REEL AS STANDARD
4. FOR QUANTITIES UP TO 49 PIECES, NO LEADER, TRAILER OR REEL WILL BE SUPPLIED
FOR QUANTITIES OF 50-124, NO LEADER OR TRAILER WILL BE SUPPLIED
5. SOLDER CRIMP VOLUME IS .20058 MM³ (0.000012691 IN³)
6. NUMBER OF POSITIONS EQUALS TOTAL NUMBER OF CIRCUITS.
7. THESE INSIDE EDGES ARE NOT TO APPEAR IN THE WINDOW WHEN VIEWED FROM DIRECTLY ABOVE.
8. DIMENSION TAKEN BETWEEN TOP AND BOTTOM PINS.
9. CHECK TO THE LEAD AND NOT THE SOLDER CRIMP.
10. SEE DOCUMENT CO-OP-WI-3001-M FOR ADDITIONAL INSTRUCTION.
11. TO CALCULATE NUMBER OF SUBS NEEDED TAKE THE NUMBER OF POSITIONS AND DIVIDE BY 4.
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
SECTION "C"-"C"
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS [INCHS]
FIG. 1
BEC5-140-02-X-X-V-A SHOWN
TOLERANCES ARE:
DECIMALS
X.X: 0.3 [.01]
2
X.XX: 0.13 [.005]
X.XXX: 0.051 [.0020]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
INSULATOR: LCP , COLOR BLACK
CONTACT: BeCu
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
BI-LEVEL EDGE CARD ASSEMBLY
BEC5-XXX-XX-X-X-V-A-XX-TR
SHEET
1
OF
2
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
BY:
M MURILLO 1/16/2009
REVISION E
"A" REF
C
L
C
C
"G"±0.10
SEE NOTE 7
"K"±0.50[.020]
2.41 .095
REF
C
L
9.55 .376
REF
13.18 .519
C
8.25 .325
0.38±0.50 .015±.020
C
7.14 .281
-K: POLYIMIDE PAD
(USE K-DOT-.325-.450-.005)
(BEC5-140-02-X-X-V-A-K SHOWN)
FIG. 2
2.29 .090
REF
0.05
- 0.05
.002
- .002
C
+0.08
+.003
BEC5-XXX-XX-V-XX
0.15 .006
1.25 .049
C
WT-16-04-T
SUB-IM-C-270-XX-X-X
1.27 .050
C
"L"±0.10
SECTION "A"-"A"
SCALE 7 : 1
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
BI-LEVEL EDGE CARD ASSEMBLY
BEC5-XXX-XX-X-X-V-A-XX-TR
SHEET
2
OF
2
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
BY:
M MURILLO 1/16/2009
Analog electronics
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