Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= +24V, V
DIM
= V
IN
, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
Input Voltage Range
Ground Current
Supply Current
UNDERVOLTAGE LOCKOUT (UVLO)
V
CS
= V
IN
- 100mV, V
IN
rising until V
LX
<
0.5V
IN
V
CS
= V
IN
- 100mV, V
IN
falling until V
LX
>
0.5V
IN
0.5
MAX16832A, V
IN
- V
CS
rising from 140mV
until V
LX
> 0.5V
IN
, V
DIM
= 5V
MAX16832C, V
IN
- V
CS
rising from 140mV
until V
LX
> 0.5V
IN
, V
DIM
= 5V
MAX16832A, V
IN
- V
CS
falling from 260mV
until V
LX
< 0.5V
IN
, V
DIM
= 5V
MAX16832C, V
IN
- V
CS
falling from 260mV
until V
LX
< 0.5V
IN
, V
DIM
= 5V
Falling edge of V
IN
- V
CS
from 140mV to
260mV to V
LX
> 0.5V
IN
Rising edge of V
CS
- V
IN
from 260mV to
140mV to V
LX
< 0.5V
IN
V
IN
- V
CS
= 200mV, V
IN
= V
CS
6.25
6.5
V
6.0
V
SYMBOL
V
IN
No switching
V
DIM
< 0.6V, V
IN
= 12V
CONDITIONS
MIN
6.5
1.5
350
TYP
MAX
65
UNITS
V
mA
µA
Undervoltage Lockout
UVLO
Undervoltage-Lockout Hysteresis
SENSE COMPARATOR
197
218
185
166
205
230
190
170
50
50
213
mV
236
198
mV
180
ns
ns
3.5
µA
Sense Voltage Threshold High
V
SNSHI
Sense Voltage Threshold Low
V
SNSLO
Propagation Delay to Output High
Propagation Delay to Output Low
CS Input Current
t
DPDH
t
DPDL
I
CSIN
2
2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= +24V, V
DIM
= V
IN
, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
INTERNAL MOSFET
V
IN
= V
DIM
= 24V, V
CS
= 23.9V,
I
LX
= 700mA
V
IN
= V
DIM
= 6.0V, V
CS
= 5.9V,
I
LX
= 700mA
V
DIM
= 0V, V
LX
= 65V
0.45
1
0.9
Ω
2
10
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX16832A/MAX16832C
Drain-to-Source Resistance
R
DSON
LX Leakage Current
DIM INPUT
DIM Input-Voltage High
DIM Input-Voltage Low
DIM Turn-On Time
DIM Input Leakage High
DIM Input Leakage Low
THERMAL SHUTDOWN
Thermal-Shutdown Threshold
Thermal-Shutdown Threshold
Hysteresis
THERMAL FOLDBACK
Thermal-Foldback Enable
Threshold Voltage
Thermal-Foldback Slope
TEMP_I Output Bias Current
I
LX_LEAK
V
IH
V
IL
t
DIM_ON
V
IN
- V
CS
= 100mV
V
CS
- V
IN
= 100mV
V
DIM
rising edge to V
LX
< 0.5V
IN
V
DIM
= V
IN
V
DIM
= 0V
Temperature rising
2.8
0.6
60
8
-3
-1.5
+165
10
15
0
V
V
ns
µA
µA
o
C
C
o
V
TFB_ON
FB
SLOPE
I
TEMP_I
V
DIM
= 5V
V
DIM
= 5V
T
A
= +25 C
o
1.9
2.0
0.75
2.12
V
1/V
25
26.5
28
µA
Typical Operating Characteristics
(V
IN
= V
DIM
= 48V, R
SENSE
= 0.3Ω, L = 220µH (connected between IN and CS). Typical values are at T
A
= +25°C, unless otherwise
noted.)
EFFICIENCY
vs. INPUT VOLTAGE
MAX16832A toc01
DUTY CYCLE
vs. INPUT VOLTAGE
90
80
DUTY CYCLE (%)
70
60
50
40
30
20
10
1 LED
3 LEDs
15 LEDs
13 LEDs
11 LEDs
9 LEDs
7 LEDs
5 LEDs
MAX16832A toc02
FREQUENCY
vs. INPUT VOLTAGE
450
400
FREQUENCY (kHz)
350
300
250
200
150
100
50
0
16 LEDs
1 LED
3 LEDs
11 LEDs
9 LEDs
7 LEDs
5 LEDs
15 LEDs
MAX16832A toc03
100
95
EFFICIENCY (%)
90
85
80
75
70
5
15
25
9 LEDs
7 LEDs
5 LEDs
3 LEDs
11 LEDs 13 LEDs 15 LEDs
100
500
13 LEDs
1 LED
0
35
V
IN
(V)
45
55
65
5
15
25
35
V
IN
(V)
45
55
65
5
15
25
35
V
IN
(V)
45
55
65
3
2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
MAX16832A/MAX16832C
Typical Operating Characteristics (continued)
(V
IN
= V
DIM
= 48V, R
SENSE
= 0.3Ω, L = 220µH (connected between IN and CS). Typical values are at T
A
= +25°C, unless otherwise
noted.)
NORMALIZED I
LED
CURRENT
vs. INPUT VOLTAGE
MAX16832A toc04
QUIESCENT CURRENT
vs. INPUT VOLTAGE
MAX16832A toc05
PWM DIMMING
AT 200Hz (10% DUTY CYCLE)
MAX16832A toc06
1.05
1.04
NORMALIZED I
LED
CURRENT
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.95
500
450
QUIESCENT CURRENT (µA)
400
350
300
250
200
150
100
50
0
V
DIM
= 0V
V
IN
= 48V
8 LEDs
I
LED
200mA/div
13 LEDs
11 LEDs 15 LEDs
7 LEDs 9 LEDs
1 LED 3 LEDs 5 LEDs
0
V
DIM
5V/div
0
0 5 10 15 20 25 30 35 40 45 50 55 60 65
V
IN
(V)
0 5 10 15 20 25 30 35 40 45 50 55 60 65
V
IN
(V)
1ms/div
PWM DIMMING
AT 200Hz (90% DUTY CYCLE )
MAX16822A toc07
PWM DIMMING
AT 20kHz (90% DUTY CYCLE)
MAX16832A toc08
I
LED
200mA/div
I
LED
200mA/div
0
V
DIM
5V/div
0
0
V
DIM
5V/div
V
IN
= 48V
8 LEDs
10µs/div
0
V
IN
= 48V
8 LEDs
1ms/div
LED CURRENT
vs. V
TEMP_I
800
750
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
V
TEMP_I
(V)
MAX16832A toc09
I
LED
vs. TEMPERATURE
0.9
0.8
0.7
I
LED
(A)
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
V
IN
= 48V
MAX16832A toc10
1.0
4
LED CURRENT (mA)
2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
MAX16832A/MAX16832C
Typical Operating Characteristics (continued)
(V
IN
= V
DIM
= 48V, R
SENSE
= 0.3Ω, L = 220µH (connected between IN and CS). Typical values are at T
A
= +25°C, unless otherwise
noted.)
LX
RDSON
vs. TEMPERATURE
V
IN
= 65V
0.6
V
IN
= 48V
LX
RDSON
(Ω)
0.5
0.4
V
IN
= 6.5V
0.3
0.2
0.1
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
MAX16832A toc11
I
TEMP_I
vs. TEMPERATURE
29.5
29.0
28.5
I
TEMP_I
(µA)
28.0
27.5
27.0
26.5
26.0
25.5
25.0
V
IN
= 48V
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
MAX16832A toc12
0.7
30.0
Pin Description
PIN
1
2
3
4
5, 6
7
8
—
NAME
CS
IN
GND
PGND
LX
DIM
TEMP_I
EP
FUNCTION
Current-Sense Input. Connect a resistor between IN and CS to program the LED current.
Positive Supply Voltage Input. Bypass with a 1µF or higher value capacitor to GND.
Ground
Power Ground
Switching Node
Logic-Level Dimming Input. Drive DIM low to turn off the current regulator. Drive DIM high to
enable the current regulator.
Thermal Foldback Control and Linear Dimming Input. Bypass with a 0.01µF capacitor to GND if
thermal foldback or analog dimming is used. See the
Thermal Foldback
section.
Exposed Pad. Connect EP to a large-area ground plane for effective power dissipation. Do not use
as the IC ground connection.
Detailed Description
The MAX16832A/MAX16832C are step-down, constant-
current, HB LED drivers. These devices operate from a
+6.5V to +65V input voltage range. The maximum output
is 1A, if the part is used at temperatures up to T
A
=
+105°C, or 700mA, if it is used up to T
A
= +125°C. A
high-side current-sense resistor sets the output current
and a dedicated PWM dimming input enables pulsed
LED dimming over a wide range of brightness levels.
A high-side current-sensing scheme and an on-board
current-setting circuitry minimize the number of exter-
nal components while delivering LED current with ±3%
accuracy, using a 1% sense resistor. See Figure 1 for a
July 15, 2010, Beijing - Agilent Technologies (NYSE: A) announced that the Agilent N7309A chipset software can now support the mass production test of the Percello Aquilo femtocell base station system...
[i=s] This post was last edited by Aguilera on 2019-2-11 22:57 [/i] [backcolor=white][color=#000000]/* All rights reserved. Property of Spectrum Digital Incorporated. */ /* * ======== evmdm642.c =====...
I just installed EVC4.0 and then SP4. Then I compiled an automatically generated example HelloWord! But after compiling, it showed: Failed downloading. This is the first time I use EVC and I am very c...
I saw someone recommend it online, so I'm sharing it with you. This toy is very suitable for developing children's intelligence. It's much more fun than the building blocks we played when we were youn...
[i=s]This post was last edited by paulhyde on 2014-9-15 09:24[/i]Do you buy chips and make the various modules you use on your car, such as tracking modules, motor drive modules, etc., yourself, or do...
Help! What should students majoring in electronic science and technology master before looking for a job? I will be a senior soon and will have to look for a job in the winter, but I am still confused...
The rapid development of the Internet has realized high-speed information transmission and resource sharing, greatly facilitating people's lives. Embedded systems are widely used in various electr...[Details]
introduction
Solar cells and LED lighting are typical applications of new energy and energy-saving and efficient technologies. Solar LED lighting uses solar cells to convert solar energy...[Details]
Images in science fiction movies often break through the limits of reality, such as in the movie "Minority Report." Tom Cruise uses a multi-touch screen to browse information. Capacitive sensing te...[Details]
Xiaomi, a well-known Internet phone in mainland China, won a million-unit order contract from China Unicom on November 20 last year, which made Xiaomi famous in mainland China. In April this year...[Details]
VP2188 is a color STN LCD module produced by Jingdian Pengyuan. This module is a dot matrix transmissive color STN display screen with a color scale of 65 k colors and white LED backlight. Its core...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
OC faults may be the most frequent and the most frequent of all faults in the inverter. They alarm during the startup process, during the shutdown process, during operation, and even when powered o...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
Preface
In recent years, white light LEDs have gradually replaced incandescent bulbs and fluorescent lamps because they have unparalleled advantages over traditional light sources in terms...[Details]
0 Introduction
With the rapid development of social economy and science and technology, electric locomotives, subways and electric vehicles will be widely used. The power conversion and cont...[Details]
The DisplayPort interface standard is approved by the Video Electronics Standards Association (VESA) to provide an open, scalable standard for the entire industry. The development of DisplayPort ca...[Details]
LED is the abbreviation of the English word. Its main meanings are: LED = Light Emitting Diode, a solid-state semiconductor device that can convert electrical energy into visible light. It can dire...[Details]
Features
POE technology can ensure the safety of existing structured cabling while ensuring the normal operation of the existing network and minimizing costs. The IEEE 802.3af standard is ...[Details]
1. Introduction
The advancement of USB technology makes designers prefer USB interfaces in PC peripheral development. However, existing
virtual instrument
development platforms such...[Details]
During the global semiconductor industry recession, the automotive electronics market has performed strongly, especially the application of car remote control systems has become more and more wides...[Details]
Test/Measurement
京公网安备 11010802033920号
EEWORLD
