|
10115F |
10115N |
| Description |
Line Driver/Receiver, ECL10K, CDIP16 |
Line Driver/Receiver, ECL10K, PDIP16 |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code |
unknown |
unknow |
| JESD-30 code |
R-XDIP-T16 |
R-PDIP-T16 |
| JESD-609 code |
e0 |
e0 |
| Nominal negative supply voltage |
-5.2 V |
-5.2 V |
| Number of terminals |
16 |
16 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-30 °C |
-30 °C |
| Package body material |
CERAMIC |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
DIP |
| Encapsulate equivalent code |
DIP16,.3 |
DIP16,.3 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
| power supply |
-5.2 V |
-5.2 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum slew rate |
29 mA |
29 mA |
| surface mount |
NO |
NO |
| technology |
ECL10K |
ECL10K |
| Temperature level |
OTHER |
OTHER |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |