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UPDS3200E3

Description
Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 200V V(RRM), Silicon, GREEN, PLASTIC, POWERDI 5, 3 PIN
CategoryDiscrete semiconductor    diode   
File Size125KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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UPDS3200E3 Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 200V V(RRM), Silicon, GREEN, PLASTIC, POWERDI 5, 3 PIN

UPDS3200E3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionR-PSSO-F2
Contacts3
Manufacturer packaging codePOWERDI 5
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS
applicationEFFICIENCY
Shell connectionCATHODE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeR-PSSO-F2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak forward current180 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Maximum output current3 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage200 V
surface mountYES
technologySCHOTTKY
Terminal surfaceMATTE TIN
Terminal formFLAT
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
UPDS3200
3 Amp 200 V High Voltage Schottky Barrier
Rectifier
SCOTTSDALE DIVISION
DESCRIPTION
The UPDS3200 offers a small and powerful surface mount package for a
high voltage 200 Volt, 3 Amp rated Schottky with low forward voltage and
low leakage current. For critical applications requiring very fast switching,
these higher voltage Schottkys with their “hot carrier” features provide
extremely fast switching to replace conventional ultrafast rectifiers. The
very low thermal resistance of the PowerDI™5 package design also
permits cooler operating junction temperatures for minimal reverse leakage
currents and lower power loss.
APPEARANCE
WWW .
Microsemi
.C
OM
PowerDI™5
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Guard Ring Die Construction for Transient Protection
High Current Low Forward Voltage Drop
Low Leakage Current
High Junction Temperature Capability
High Forward Surge Current Capability
Environmentally Friendly “Green” Molding Compound
(No Br, Sb)
Low inductive parasitics for minimal Ldi/dt effects
Lead-Free Finish & RoHS Compliant per EU Directive
Rev 13.2.2003 (Glass and High Temperature Solder
Exemptions Applied per Annex Notes 5 and 7 therein)
APPLICATIONS / BENEFITS
Silicon Schottky (hot carrier) rectifier for minimal t
rr
and elimination of reverse-recovery oscillations to
reduce need for EMI filtering
For use in high-frequency switching power
supplies, inverters, free wheeling, and polarity
protection applications
Low power loss and high efficiency
Robust package configuration for pick-and-place
handling
Full-metallic bottom eliminates flux entrapment
MAXIMUM RATINGS
Junction and Storage Temperature (T
J
, T
STG
): -65 to
+150
o
C
Average Rectified Output Current (I
O
): 3 Amps for
Single phase, half wave, 60Hz, resistive or inductive
load (also see Figure 5). For capacitive load, derate
current by 20%.
Peak Repetitive Reverse Voltage (V
RRM
): 200 V
Working Peak Reverse Voltage (V
RWM
): 200 V
DC Blocking Voltage (V
R
): 200 V
RMS Reverse Voltage (V
R(RMS)
): 141 V
Non-Repetitive Peak Forward Surge Current @ 8.3 ms
Single half sine-wave Superimposed on Rated Load
(I
FSM
): 180A
Thermal Resistance Junction to bottom of case (R
θJC
)
o
or Junction to Soldering Point (R
θJS
): 2.0 C/W
Thermal Resistance (R
θJA
): 90
o
C/W junction to ambient
when mounted on
FR-4 PCB,
2 oz. Copper and
minimum recommended pad layout (see last page)
MECHANICAL AND PACKAGING
Case Material: Molded Plastic, Environmentally
Friendly “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020C.
Terminals: Finish – Matte Tin annealed over
Copper lead frame
(
per JESD97)
Solderable per MIL-STD-202, Method 208
Marking: See marking information on page 3
Polarity: See Diagram
Weight: 0.096 grams (approx.)
Tape & Reel Option: 5000/reel (13”)
UPDS3200
Copyright
©
2005
7-01-2005 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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