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4608H-803-500103

Description
KONDENSATOR NETZWERK
File Size2MB,62 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
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4608H-803-500103 Overview

KONDENSATOR NETZWERK

w w w . b o u r n s . c o m
Resistor Networks
I.
II.
Product Selection Guide...........................................................278
Popular Resistance Codes........................................................284
III. Thick Film Products
Through-hole Packages
Molded DIPs...................................................................286
Molded SIPs...................................................................288
Conformal SIPs ..............................................................294
Surface Mount Packages
Wide Body ......................................................................300
Medium Body .................................................................302
Ordering Guide ...............................................................304
RC Networks
T-Filters (EMI/RFI Low-Pass Filters)...............................305
RC Terminators ..............................................................307
ECL Terminators .............................................................309
Capacitor Networks ........................................................312
IV.
Precision Thin-Film-on-Ceramic Products
Through-hole Packages ......................................................313
Surface Mount Packages ....................................................318
For a complete listing of thick film products
in stock and readily available through distri-
bution, see page 284.
VI. Designer’s Guide and Application Notes
EMI/RFI Filters................................................................320
RC Terminator Networks ................................................322
Emitter Coupled Logic Terminators ................................324
Dual Terminator Resistor Networks................................326
SCSI ...............................................................................327
R/2R Ladder Networks ...................................................330
DRAM Applications ........................................................331
Thin Film Applications ....................................................334
Soldering and Cleaning Processes .................................336
Specifications are subject to change without notice.
277
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