The ASM3P2969A uses the most efficient and optimized
modulation profile approved by the FCC and is
implemented by using a proprietary all digital method.
The ASM3P2969A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
by oscillators and most frequency generators. Lowering
EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation’.
Applications
The ASM3P2969A is targeted towards all portable
devices with very low power requirements like MP3
players, Notebooks and digital still cameras.
Product Description
The ASM3P2969A is a versatile spread spectrum
frequency modulator designed specifically for a wide
range of clock frequencies. The ASM3P2969A reduces
electromagnetic interference (EMI) at the clock source,
allowing system wide reduction of EMI of
all clock
dependent signals. The ASM3P2969A allows significant
system cost savings by reducing the number of circuit
board layers ferrite beads, shielding that are traditionally
required to pass EMI regulations.
Key Specifications
Description
Supply voltages
Cycle-to-Cycle Jitter
Output Duty Cycle
Modulation Rate Equation
Frequency Deviation
Specification
VDD = 3.3V /2.5V
200pS (Max)
45/55%
F
IN
/256
±1% @ 10MHz
Block Diagram
VDD
Modulation
XIN
XOUT
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
REFOUT/2
DIV/2
Phase
Detector
Loop
Filter
VCO
PLL
Output
Divider
ModOUT
VSS
Alliance Semiconductor
2575 Augustine Drive
•
Santa Clara, CA
•
Tel: 408.855.4900
•
Fax: 408.855.4999
•
www.alsc.com
Notice: The information in this document is subject to change without notice.
September 2005
rev 1.6
Pin Configuration (6-pin TSOT- 23 Package)
ASM3P2969A
REFOUT/2
1
XOUT
2
6
VSS
ModOUT
VDD
ASM3P2969A
5
4
XIN/CLKIN
3
Pin Description
Pin#
1
2
3
4
5
6
Pin Name
REFOUT/2
XOUT
XIN/CLKIN
VDD
ModOUT
VSS
Type
O
O
I
P
O
P
Description
Buffered and divided by 2 output of the input frequency.
Crystal connection. If using an external reference, this pin must be left unconnected.
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected either to an external crystal or an external reference clock.
Power supply for the entire chip
Spread spectrum clock output.
Ground connection.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
2 of 12
September 2005
rev 1.6
Pin Configuration (8-pin SOIC and TSSOP Packages)
ASM3P2969A
XIN/CLKIN
1
XOUT
2
8
7
6
5
VDD
NC
ModOUT
VSS
ASM3P2969A
REFOUT/2
3
NC
4
Pin Description
Pin#
1
2
3
4
5
6
7
8
Pin Name
XIN/CLKIN
XOUT
REFOUT/2
NC
VSS
ModOUT
NC
VDD
Type
I
O
O
-
P
O
-
P
Description
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected either to an external crystal or an external reference clock.
Crystal connection. If using an external reference, this pin must be left unconnected.
Buffered and divided by 2 output of the input frequency.
No connect.
Ground connection.
Spread spectrum clock output.
No connect.
Power supply for the entire chip
Modulation Profile
Specifications
Description
Frequency Range
For 2.5V Supply
For 3.3V Supply
Specification
6MHz < CLKIN < 12MHz
6MHz < CLKIN < 13MHz
F
IN
/256
±1% @ 10MHz
Modulation Equation
Frequency Deviation
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
3 of 12
September 2005
rev 1.6
Absolute Maximum Ratings
Symbol
VDD, V
IN
T
STG
T
A
T
s
T
J
T
DV
Storage temperature
Operating temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
ASM3P2969A
Parameter
Rating
-0.5 to +7.0
-65 to +125
0 to 70
260
150
2
Unit
V
°C
°C
°C
°C
KV
Voltage on any pin with respect to Ground
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics for 2.5V Supply
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
DD
I
CC
VDD
t
ON
Z
OUT
Input low voltage
Input high voltage
Input low current
Input high current
Parameter
Min
VSS - 0.3
2.0
-
-
-
-
-
1.8
-
-
2.375
-
-
Typ
-
-
-
-
3
3
-
-
1.0
2.5
2.5
-
50
Max
0.8
VDD + 0.3
-35
35
-
-
0.6
-
-
-
2.625
5
-
Unit
V
V
µA
µA
mA
mA
V
V
mA
mA
V
mS
Ω
XOUT output low current (@0.5V, VDD=2.5V)
XOUT output high current (@1.8V, VDD=2.5V)
Output low voltage (VDD = 2.5 V, I
OL
= 8mA)
Output high voltage (VDD = 2.5 V, I
OH
= 8mA)
Static supply current *
Dynamic supply current (2.5V, 10MHz and no load)
Operating Voltage
Power-up time (first locked cycle after power-up)
Output impedance
* XIN / CLKIN pin is pulled low
AC Electrical Characteristics for 2.5V Supply
Symbol
CLKIN
ModOUT
f
d
t
LH
*
t
HL
*
t
JC
t
D
Input frequency
Output frequency
Frequency Deviation
Input Frequency = 6MHz
Input Frequency = 12MHz
Parameter
Min
6
6
-
-
0.7
0.4
-
45
Typ
-
-
±1.5
±0.8
1.4
0.9
-
50
Max
12
12
-
-
1.7
1.1
200
55
Unit
MHz
MHz
%
nS
nS
pS
%
Output rise time (measured from 0.7V to 1.7V)
Output fall time (measured from 1.7V to 0.7V)
Jitter (cycle to cycle)
Output duty cycle
* t
LH
and t
HL
are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
4 of 12
September 2005
rev 1.6
DC Electrical Characteristics for 3.3V Supply
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
ASM3P2969A
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
DD
I
CC
VDD
t
ON
Z
OUT
Input low voltage
Input high voltage
Input low current
Input high current
Parameter
Min
VSS - 0.3
2.0
-
-
-
-
-
2.5
-
-
2.7
-
-
Typ
-
-
-
-
3
3
-
-
1.1
3.5
3.3
-
45
Max
0.8
VDD + 0.3
-35
35
-
-
0.4
-
-
-
3.6
5
-
Unit
V
V
µA
µA
mA
mA
V
V
mA
mA
V
mS
Ω
XOUT output low current (@0.4V, VDD=3.3V)
XOUT output high current (@2.5V, VDD=3.3V)
Output low voltage (VDD = 3.3 V, I
OL
= 8mA)
Output high voltage (VDD = 3.3 V, I
OH
= 8mA)
Static supply current *
Dynamic supply current (3.3V, 10MHz and no load)
Operating Voltage
Power-up time (first locked cycle after power-up)
Output impedance
* XIN / CLKIN pin is pulled low
AC Electrical Characteristics for 3.3V Supply
Symbol
CLKIN
ModOUT
f
d
t
LH
*
t
HL
*
t
JC
t
D
Input frequency
Output frequency
Frequency Deviation
Input Frequency = 6MHz
Input Frequency = 13MHz
Parameter
Min
6
6
-
-
0.4
0.4
-
45
Typ
-
-
±1.5
±0.75
1.2
1.0
-
50
Max
13
13
-
-
1.5
1.2
200
55
Unit
MHz
MHz
%
nS
nS
pS
%
Output rise time (measured from 0.8 to 2.0V)
Output fall time (measured at 2.0V to 0.8V)
Jitter (cycle to cycle)
Output duty cycle
*t
LH
and t
HL
are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
I would like to ask, after adding two diodes to compensate for this push-pull output circuit, a slight phase shift occurs. How can I solve this problem?...
When configuring the wifi wireless network, I found the wireless network configuration tool WZC TOOL provided by wince. However, I compiled WZC TOOL to generate an .exe file, and then loaded it in she...
After PT2248 transmits, PT2249 receives. The corresponding pin output level seems to be not latched. It is output only when the key is pressed. How can the level output be continuous after the key is ...
I participated in electronic design competitions when I was in school, but I didn't get any results. Later, I led a team to participate in several competitions after I started working. Overall, my exp...
There are many ways to debug MCU programs, such as software/hardware simulation, adding data printing, etc.Keil MDK, for example, supports software simulation of many microcontrollers. Without getting...
As the saying goes, “If you want to do your work well, you must first sharpen your tools.”
For the LPS27HHW pressure sensor, in order to make it work, in addition to processing the driver, it is also ...
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Shenzhen Baowei Power Supply high frequency pure sine wave power, communication inverter power supply has two communication interfaces, RS232 and R485 interfaces, their functions and characteristic...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
Which is better, copper braided wire flexible connector or copper stranded wire flexible connector? When choosing copper wire flexible connector, people always struggle with whether to use copper b...[Details]
The assisted driving industry in 2025 stands at the dual crossroads of "large-scale implementation" and "safety upgrades." Cities like Beijing and Wuhan have already issued regulations de...[Details]
The term "remote meter reading" literally emphasizes remoteness. But how far is remote? One kilometer? Two kilometers? Those aren't considered far at all. Currently, the longest distance for ...[Details]