MC14501UBCPD datasheet, PDF - EEWORLD Datasheet

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MC14501UBCPD: DescriptionIC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,PLASTIC; Categorylogic logic; File Size696KB，10 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14501UBCPD Overview

IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,PLASTIC

MC14501UBCPD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC14501UBCPD Related Products

	MC14501UBCPD	MC14501UBCLDS	MC14501UBALDS	MC14501UBAL	MC14501UBALD	MC14501UBCPDS
Description	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,PLASTIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknow	unknow	unknow
JESD-30 code	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Schmitt trigger	NO	NO	NO	NO	NO	NO
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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