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MH88631-1

Description
SLIC, Hybrid, SIP-40
CategoryWireless rf/communication    Telecom circuit   
File Size55KB,3 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Download Datasheet Parametric Compare View All

MH88631-1 Overview

SLIC, Hybrid, SIP-40

MH88631-1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionSIP, SIP40,.1
Reach Compliance Codeunknown
JESD-30 codeX-XSIP-T40
JESD-609 codee0
Number of functions1
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeSIP
Encapsulate equivalent codeSIP40,.1
Package shapeUNSPECIFIED
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply+-5,+-12 V
Certification statusNot Qualified
Maximum slew rate0.008 mA
surface mountNO
technologyHYBRID
Telecom integrated circuit typesSLIC
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
®
MH88631
Central Office Interface (LS/GS)
Preliminary Information
Features
Transformerless 2-4 wire conversion
Line state detection outputs
- forward current
- reverse current
- ring ground
- tip ground
- ringing voltage
ISSUE 4
April 1995
Ordering Information
MH88631-1
MH88631-2
40 Pin SIL Package
40 Pin SIL Package
0°C to 70°C
ed
nd n
• Programmable audio transmit and receive gain
e
Description
g
• Loop start or ground start termination
m si
The Mitel MH88631-1, 2 Central Office Trunk
• Selectable 600Ω or AT&T compromise balance
e
2B
om D
Interface circuit provides a complete audio and
network
signalling link
audio switching equipment
ec w 863
a central betweenThe loop seize circuitry is
• -1 version: 20Hz Ringing Voltage
t R Ne H8
and by anoffice. input to provide either a
• -2 version: 50Hz Ringing Voltage
controlled
external
o r M
loop start of ground start termination. The device is
N fo e
fabricated using thick film ceramic technology to
Applications
e
achieve high density circuit design.
S
PBX
Channel bank
Intercom
Key System
RG FC RV RC TG
LPGND RINGND
VCC+ VCC- AGND
T
R
Signal Detection
Circuitry
Ring
Ground
Relay
Driver 1
Relay
Driver 2
RC1
RD1
RGND
CD
RD2
RC2
NETBAL
Network
Balance
VTR+
VTR-
RXIN-
RXIN+
Active
Termination
Audio Section
Circuitry
(2-4 Wire)
GSX
VX
VR
GSR
QB QE XA XB XC
VDD VEE
RXOUT
TXIN+ TXIN-
Figure 1 - Functional Block Diagram
2-243

MH88631-1 Related Products

MH88631-1 MH88631-2
Description SLIC, Hybrid, SIP-40 SLIC, Hybrid, SIP-40
Is it Rohs certified? incompatible incompatible
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction SIP, SIP40,.1 SIP, SIP40,.1
Reach Compliance Code unknown unknown
JESD-30 code X-XSIP-T40 X-XSIP-T40
JESD-609 code e0 e0
Number of functions 1 1
Number of terminals 40 40
Maximum operating temperature 70 °C 70 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code SIP SIP
Encapsulate equivalent code SIP40,.1 SIP40,.1
Package shape UNSPECIFIED UNSPECIFIED
Package form IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply +-5,+-12 V +-5,+-12 V
Certification status Not Qualified Not Qualified
Maximum slew rate 0.008 mA 0.008 mA
surface mount NO NO
technology HYBRID HYBRID
Telecom integrated circuit types SLIC SLIC
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
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