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SLE25C010-S

Description
EEPROM, 128X8, Serial, CMOS, PDSO8, PLASTIC, DSO-8
Categorystorage    storage   
File Size674KB,29 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

SLE25C010-S Overview

EEPROM, 128X8, Serial, CMOS, PDSO8, PLASTIC, DSO-8

SLE25C010-S Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerInfineon
Parts packaging codeSOIC
package instructionPLASTIC, DSO-8
Contacts8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum clock frequency (fCLK)2.1 MHz
Data retention time - minimum40
Durability1000000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
memory density1024 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)4.5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
write protectHARDWARE/SOFTWARE
Standard EEPROM ICs
SLx 25C010
1 KBit (128
×
8 bit)
Serial CMOS-EEPROM with
Serial Peripheral Interface (SPI) Synchronous Bus
Data Sheet Preliminary 1999-03-15

SLE25C010-S Related Products

SLE25C010-S SLA25C010-S SLA25C010-S/P SLE25C010-D SLE25C010-D/P SLA25C010-D/P SLA25C010-D
Description EEPROM, 128X8, Serial, CMOS, PDSO8, PLASTIC, DSO-8 EEPROM, 128X8, Serial, CMOS, PDSO8, PLASTIC, DSO-8 EEPROM, 128X8, Serial, CMOS, PDSO8, PLASTIC, DSO-8 EEPROM, 128X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC DIP DIP DIP DIP
package instruction PLASTIC, DSO-8 PLASTIC, DSO-8 PLASTIC, DSO-8 PLASTIC, DIP-8 PLASTIC, DIP-8 PLASTIC, DIP-8 PLASTIC, DIP-8
Contacts 8 8 8 8 8 8 8
Reach Compliance Code not_compliant unknown unknown unknown unknown not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz
Data retention time - minimum 40 40 40 40 40 40 40
Durability 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles 1000000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-PDIP-T8 R-PDIP-T8
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 4.9 mm 4.9 mm 4.9 mm 9.4 mm 9.4 mm 9.4 mm 9.4 mm
memory density 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 128 words 128 words 128 words 128 words 128 words 128 words 128 words
character code 128 128 128 128 128 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128X8 128X8 128X8 128X8 128X8 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP DIP DIP DIP DIP
Encapsulate equivalent code SOP8,.25 SOP8,.25 SOP8,.25 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 1.75 mm 4.7 mm 4.7 mm 4.7 mm 4.7 mm
Serial bus type SPI SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
surface mount YES YES YES NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 3.9 mm 3.9 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches - 1 1 1 1 - -
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