|
Z8030DIB |
Z8530DIB |
Z8030DMB |
Z8030PCB |
Z8530APCB |
Z8530DMB |
| Description |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, PDIP40, PLASTIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, PDIP40, PLASTIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.125MBps, MOS, CDIP40, HERMETIC SEALED, DIP-40 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
DIP |
DIP |
DIP |
DIP |
DIP |
DIP |
| package instruction |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
| Contacts |
40 |
40 |
40 |
40 |
40 |
40 |
| Reach Compliance Code |
compliant |
unknown |
compliant |
compliant |
unknown |
unknown |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
| Bus compatibility |
Z8000; 8086 |
8080; Z80; 6800; 68000; MULTIBUS |
Z8000; 8086 |
Z8000; 8086 |
8080; Z80; 6800; 68000; MULTIBUS |
8080; Z80; 6800; 68000; MULTIBUS |
| maximum clock frequency |
4 MHz |
4 MHz |
4 MHz |
4 MHz |
6.06 MHz |
4 MHz |
| letter of agreement |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
| Data encoding/decoding methods |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
0.125 MBps |
| External data bus width |
8 |
8 |
8 |
8 |
8 |
8 |
| JESD-30 code |
R-CDIP-T40 |
R-CDIP-T40 |
R-CDIP-T40 |
R-PDIP-T40 |
R-PDIP-T40 |
R-CDIP-T40 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
52.324 mm |
52.324 mm |
52.324 mm |
52.578 mm |
52.578 mm |
52.324 mm |
| low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
| Number of serial I/Os |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
40 |
40 |
40 |
40 |
40 |
40 |
| Maximum operating temperature |
85 °C |
85 °C |
125 °C |
70 °C |
70 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-55 °C |
- |
- |
-55 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
DIP |
DIP |
DIP |
DIP |
DIP |
DIP |
| Encapsulate equivalent code |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.715 mm |
5.715 mm |
5.715 mm |
5.08 mm |
5.08 mm |
5.715 mm |
| Maximum slew rate |
250 mA |
250 mA |
250 mA |
250 mA |
250 mA |
250 mA |
| Maximum supply voltage |
5.25 V |
5.25 V |
5.5 V |
5.25 V |
5.25 V |
5.5 V |
| Minimum supply voltage |
4.75 V |
4.75 V |
4.5 V |
4.75 V |
4.75 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
| technology |
MOS |
MOS |
MOS |
MOS |
MOS |
MOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
COMMERCIAL |
COMMERCIAL |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
| uPs/uCs/peripheral integrated circuit type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Maker |
AMD |
- |
AMD |
AMD |
AMD |
AMD |