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GRM32RR11C475KC01B

Description
CAPACITOR, CERAMIC, MULTILAYER, 16V, R, 4.7uF, SURFACE MOUNT, 1210, CHIP
CategoryPassive components    capacitor   
File Size18KB,1 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Environmental Compliance  
Download Datasheet Parametric View All

GRM32RR11C475KC01B Overview

CAPACITOR, CERAMIC, MULTILAYER, 16V, R, 4.7uF, SURFACE MOUNT, 1210, CHIP

GRM32RR11C475KC01B Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMurata
package instruction, 1210
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance4.7 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberGRM32
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)16 V
size code1210
surface mountYES
Temperature characteristic codeR
Temperature Coefficient15% ppm/°C
Terminal surfaceTin (Sn)
Terminal shapeWRAPAROUND
Capacitors > Monolithic Ceramic Capacitors
Data Sheet
Monolithic Ceramic Capacitors
GRM32RR11C475KC01p
(1210, R, 4.7µF, 16Vdc)
p:
packaging code
RoHS regulation conformity parts
e
g
e
L
W
(in mm)
I
Dimensions
Length L
Width W
Thickness T
Electrode e (min.)
Electrode Gap g (min.)
3.2mm±0.3mm
2.5mm±0.2mm
1.8mm±0.2mm
0.3mm
1.0mm
I
Packaging
Code
L
K
B
Packaging
180mm Embossed Tape
330mm Embossed Tape
Bulk(Bag)
Minimum Quantity
1000
4000
1000
I
Specifications
I
Rated Value
TC Code
TC Code (Standard)
Capacitance Change
Capacitance
Rated Voltage
R1
R (JIS)
±15%
4.7µF±10%
16Vdc
Please refer to 'Specification' PDF file.
data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.
<Notice>
o
Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin
melting point is used. Please confirm the solderability of Tin plating termination chip before use.
o
Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please contact murata factory for the use of Sn-Zn based solder in advance.
o
This
• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent
chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.
• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members
individually with regards to the RoHS Directive.
!
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
T
2006.3.9
http://www.murata.com/

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