TMS320C6670ACYPA2 datasheet, PDF

TMS320C6670ACYPA2: DescriptionMulticore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，226 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	FBGA, BGA841,29X29,32
Contacts	841
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	12 weeks
barrel shifter	NO
bit size	32
boundary scan	YES
Format	FLOATING POINT
Integrated cache	YES
Internal bus architecture	SINGLE
JESD-30 code	S-PBGA-B841
JESD-609 code	e1
length	24 mm
low power mode	YES
Humidity sensitivity level	4
Number of DMA channels	80
Number of terminals	841
Number of timers	16
Maximum operating temperature	100 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA841,29X29,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	245
power supply	1,1.5,1.8 V
Certification status	Not Qualified
RAM (number of words)	32768
Maximum seat height	3.39 mm
Maximum supply voltage	1.05 V
Minimum supply voltage	0.95 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, MIXED
Base Number Matches	1

	TMS320C6670ACYPA2	TMX320C6670AXCYP
Description	Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100	Digital Signal Processors & Controllers - DSP, DSC Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA 0 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Contains lead
package instruction	FBGA, BGA841,29X29,32	FBGA,
Reach Compliance Code	compli	unknow
barrel shifter	NO	NO
boundary scan	YES	YES
Format	FLOATING POINT	FLOATING POINT
Internal bus architecture	SINGLE	SINGLE
JESD-30 code	S-PBGA-B841	S-PBGA-B841
length	24 mm	24 mm
low power mode	YES	YES
Number of terminals	841	841
Maximum operating temperature	100 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
Maximum seat height	3.39 mm	3.39 mm
Maximum supply voltage	1.05 V	1.05 V
Minimum supply voltage	0.95 V	0.95 V
Nominal supply voltage	1 V	1 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
width	24 mm	24 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, MIXED	DIGITAL SIGNAL PROCESSOR, OTHER

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