Micro Peripheral IC, CMOS, CPGA68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XPGA-P68 |
| Number of terminals | 68 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA68,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 50 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Z16C30-10GME | Z16C30-10GMB | |
|---|---|---|
| Description | Micro Peripheral IC, CMOS, CPGA68 | Micro Peripheral IC, CMOS, CPGA68 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | IXYS | IXYS |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | S-XPGA-P68 | S-XPGA-P68 |
| Number of terminals | 68 | 68 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | PGA | PGA |
| Encapsulate equivalent code | PGA68,11X11 | PGA68,11X11 |
| Package shape | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 50 mA | 50 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal form | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR |